CONN IC DIP SOCKET ZIF 44POS
| Part | Material Flammability Rating | Contact Material - Mating | Contact Finish - Mating | Type | Type | Type | Contact Material - Post | Number of Positions or Pins (Grid) | Housing Material | Termination | Pitch - Post | Pitch - Post | Mounting Type | Features | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Termination Post Length | Termination Post Length | Current Rating (Amps) | Operating Temperature [Min] | Operating Temperature [Max] | 
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics  | UL94 V-0  | Beryllium Copper  | Nickel Boron  | 15.24 mm  | DIP  ZIF (ZIP)  | 0.6 "  | Beryllium Copper  | 44 Positions or Pins  | Polyphenylene Sulfide (PPS)  Glass Filled  | Solder  | 2.54 mm  | 0.1 in  | Through Hole  | Closed Frame  | 0.1 in  | 2.54 mm  | 1.27 µm  | 50 µin  | Nickel Boron  | 1.27 µm  | 50 µin  | 0.11 in  | 2.78 mm  | 1 A  | ||
Aries Electronics  | UL94 V-0  | Beryllium Nickel  | Nickel Boron  | 15.24 mm  | DIP  ZIF (ZIP)  | 0.6 "  | Beryllium Nickel  | 44 Positions or Pins  | Polyetheretherketone (PEEK)  Glass Filled  | Solder  | 2.54 mm  | 0.1 in  | Through Hole  | Closed Frame  | 0.1 in  | 2.54 mm  | 1.27 µm  | 50 µin  | Nickel Boron  | 1.27 µm  | 50 µin  | 0.11 in  | 2.78 mm  | 1 A  | -55 °C  | 250 °C  |