SOLDER WIRE 60/40 TIN/LEAD (SN60
| Part | Flux Type | Type | Melting Point [Min] [custom] | Melting Point [Max] [custom] | Melting Point [Min] [custom] | Melting Point [Max] [custom] | Process | Form | Form | Form | Diameter [diameter] | Diameter [diameter] | Composition | Melting Point [custom] | Melting Point [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Chip Quik Inc. NC2SW.015 8OZ | No-Clean | Wire Solder | 361 °F | 370 °F | 183 °C | 188 °C | Leaded | 226.8 g | 8 oz | Spool | 0.015 in | 0.38 mm | Sn60Pb40 (60/40) | ||
Chip Quik Inc. NC2SW.015 0.2OZ | No-Clean | Wire Solder | 361 °F | 370 °F | 183 °C | 188 °C | Leaded | 0.2 oz, 5.66 g | Tube | 0.015 in | 0.38 mm | Sn60Pb40 (60/40) | |||
Chip Quik Inc. NC2SWLF.015 2OZ | No-Clean | Wire Solder | 56.7 g | 2 oz | Spool | 0.015 in | 0.38 mm | Sn99.3Cu0.7 (99.3/0.7) | 441 °F | 227 °C | |||||
Chip Quik Inc. NC2SWLF.015 4OZ | No-Clean | Wire Solder | 113.4 g | 4 oz | Spool | 0.015 in | 0.38 mm | Sn99.3Cu0.7 (99.3/0.7) | 441 °F | 227 °C | |||||
Chip Quik Inc. NC2SW.015 1OZ | No-Clean | Wire Solder | 361 °F | 370 °F | 183 °C | 188 °C | Leaded | 28.35 g | 1 oz | Spool | 0.015 in | 0.38 mm | Sn60Pb40 (60/40) | ||
Chip Quik Inc. NC2SW.015 1LB | No-Clean | Wire Solder | 361 °F | 370 °F | 183 °C | 188 °C | Leaded | 16 oz | 1 lb | Spool | 0.015 in | 0.38 mm | Sn60Pb40 (60/40) | ||
Chip Quik Inc. NC2SWLF.015 1LB | No-Clean | Wire Solder | 16 oz | 1 lb | Spool | 0.015 in | 0.38 mm | Sn99.3Cu0.7 (99.3/0.7) | 441 °F | 227 °C | |||||
Chip Quik Inc. NC2SW.015 2OZ | No-Clean | Wire Solder | 361 °F | 370 °F | 183 °C | 188 °C | Leaded | 56.7 g | 2 oz | Spool | 0.015 in | 0.38 mm | Sn60Pb40 (60/40) | ||
Chip Quik Inc. NC2SW.015 4OZ | No-Clean | Wire Solder | 361 °F | 370 °F | 183 °C | 188 °C | Leaded | 113.4 g | 4 oz | Spool | 0.015 in | 0.38 mm | Sn60Pb40 (60/40) | ||
Chip Quik Inc. NC2SWLF.015 8OZ | No-Clean | Wire Solder | 226.8 g | 8 oz | Spool | 0.015 in | 0.38 mm | Sn99.3Cu0.7 (99.3/0.7) | 441 °F | 227 °C |