10039755 Series

Catalog

CONN PCI EXP FMALE 64POS 0.039

Part	Material - Insulation	Color	Number of Rows	Card Type	Features	Contact Finish Thickness	Contact Type	Contact Finish	Termination	Pitch	Read Out	Number of Positions	Gender	Mounting Type	Contact Material	Operating Temperature (Min)	Operating Temperature (Max)	Card Thickness	Number of Bay	Termination Rows
Amphenol ICC (FCI) 10039755-10011TLF	Glass Filled Nylon PA Polyamide	Black	2	PCI Express™	Board Guide Locking Ramp	30 µin	Cantilever	Gold	Solder Staggered	0.039 in	Dual	64	Female	Through Hole	Copper Alloy	-55 °C	85 °C	0.062 in
Amphenol ICC (FCI) 10039755-10111TLF	Glass Filled Nylon PA Polyamide	Black	2	PCI Express™	Board Guide Locking Ramp	15 µin	Cantilever	Gold	Press-Fit	0.039 in	Dual	11 64	Female	Through Hole	Copper Alloy	-55 °C	85 °C	0.062 in	21
Amphenol ICC (FCI) 10039755-10012T	Glass Filled Nylon PA Polyamide	Black	2	PCI Express™	Board Guide Locking Ramp	30 µin	Cantilever	Gold	Press-Fit	0.079 in	Dual	49 98	Female	Through Hole	Copper Alloy	-55 °C	85 °C	0.062 in		4 rows
Amphenol ICC (FCI) 10039755-10113TLF	Glass Filled Nylon PA Polyamide	Black	2	PCI Express™	Board Guide Locking Ramp	15 µin	Cantilever	Gold	Press-Fit	0.039 in	Dual	164	Female	Through Hole	Copper Alloy	-55 °C	85 °C	0.062 in
Amphenol ICC (FCI) 10039755-10110TLF	Glass Filled Nylon PA Polyamide	Black	2	PCI Express™	Board Guide Locking Ramp	15 µin	Cantilever	Gold	Solder Staggered	0.039 in	Dual	36	Female	Through Hole	Copper Alloy	-55 °C	85 °C	0.062 in
Amphenol ICC (FCI) 10039755-10311T	Glass Filled Nylon PA Polyamide	Black	2	PCI Express™	Board Guide Locking Ramp	30 µin	Cantilever	Gold	Solder Staggered	0.039 in	Dual	64	Female	Through Hole	Copper Alloy	-55 °C	85 °C	0.062 in
Amphenol ICC (FCI) 10039755-10003TLF	Glass Filled Nylon PA Polyamide	Black	2	PCI Express™	Board Guide Locking Ramp	30 µin	Cantilever	Gold	Press-Fit	0.039 in	Dual	164	Female	Through Hole	Copper Alloy	-55 °C	85 °C	0.062 in
Amphenol ICC (FCI) 10039755-10102TLF	Glass Filled Nylon PA Polyamide	Black	2	PCI Express™	Board Guide Locking Ramp	15 µin	Cantilever	Gold	Solder Staggered	0.039 in	Dual	98	Female	Through Hole	Copper Alloy	-55 °C	85 °C	0.062 in
Amphenol ICC (FCI) 10039755-10312T	Glass Filled Nylon PA Polyamide	Black	2	PCI Express™	Board Guide Locking Ramp	30 µin	Cantilever	Gold	Solder Staggered	0.039 in	Dual	98	Female	Through Hole	Copper Alloy	-55 °C	85 °C	0.062 in
Amphenol ICC (FCI) 10039755-10002TLF	Glass Filled Nylon PA Polyamide	Black	2	PCI Express™	Board Guide Locking Ramp	30 µin	Cantilever	Gold	Solder Staggered	0.039 in	Dual	98	Female	Through Hole	Copper Alloy	-55 °C	85 °C	0.062 in