40-C182 Series
Manufacturer: Aries Electronics
CONN IC DIP SOCKET 40POS GOLD
| Part | Contact Finish Thickness - Post | Pitch - Mating | Pitch - Post | Mounting Type | Features | Grid Columns | Number of Positions or Pins (Grid) | Grid Rows | Contact Finish Thickness - Mating | Contact Material - Post | Contact Finish - Mating | Termination | Operating Temperature (Min) | Operating Temperature (Max) | Contact Material - Mating | Contact Finish - Post | Row Spacing | Type | Housing Material | Termination Post Length | Current Rating | Material Flammability Rating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 200 µin | 0.1 in | 0.1 in | Through Hole | Closed Frame | 20 | 40 | 2 | 10 µin | Brass | Gold | Solder | -55 °C | 105 °C | Beryllium Copper | Tin | 0.6 in | 0.6" (15.24mm) Row Spacing DIP | Glass Filled Nylon 4/6 PA46 Polyamide | 0.125 in | 3 A | UL94 V-0 |
Aries Electronics | 10 µin | 0.1 in | 0.1 in | Through Hole | Closed Frame | 20 | 40 | 2 | 10 µin | Brass | Gold | Solder | -55 °C | 125 °C | Beryllium Copper | Gold | 0.6 in | 0.6" (15.24mm) Row Spacing DIP | Glass Filled Nylon 4/6 PA46 Polyamide | 0.125 in | 3 A | UL94 V-0 |
Aries Electronics | 200 µin | 0.1 in | 0.1 in | Surface Mount | Closed Frame | 20 | 40 | 2 | 10 µin | Brass | Gold | Solder | -55 °C | 105 °C | Beryllium Copper | Tin | 0.6 in | 0.6" (15.24mm) Row Spacing DIP | Glass Filled Nylon 4/6 PA46 Polyamide | 0.04 in | 3 A | UL94 V-0 |
Aries Electronics | 10 µin | 0.1 in | 0.1 in | Through Hole | Closed Frame | 20 | 40 | 2 | 10 µin | Brass | Gold | Solder | -55 °C | 125 °C | Beryllium Copper | Gold | 0.6 in | 0.6" (15.24mm) Row Spacing DIP | Glass Filled Nylon 4/6 PA46 Polyamide | 0.125 in | 3 A | UL94 V-0 |
Aries Electronics | 200 µin | 0.1 in | 0.1 in | Surface Mount | Closed Frame | 20 | 40 | 2 | 10 µin | Brass | Gold | Solder | -55 °C | 105 °C | Beryllium Copper | Tin | 0.6 in | 0.6" (15.24mm) Row Spacing DIP | Glass Filled Nylon 4/6 PA46 Polyamide | 0.04 in | 3 A | UL94 V-0 |
Aries Electronics | 10 µin | 0.1 in | 0.1 in | Surface Mount | Closed Frame | 20 | 40 | 2 | 10 µin | Brass | Gold | Solder | -55 °C | 125 °C | Beryllium Copper | Gold | 0.6 in | 0.6" (15.24mm) Row Spacing DIP | Glass Filled Nylon 4/6 PA46 Polyamide | 0.04 in | 3 A | UL94 V-0 |
Aries Electronics | 200 µin | 0.1 in | 0.1 in | Through Hole | Closed Frame | 20 | 40 | 2 | 10 µin | Brass | Gold | Wire Wrap | -55 °C | 105 °C | Beryllium Copper | Tin | 0.6 in | 0.6" (15.24mm) Row Spacing DIP | Glass Filled Nylon 4/6 PA46 Polyamide | 0.04 in | 3 A | UL94 V-0 |