CONN RCPT 90POS 0.1 GOLD SMD
| Part | Features | Operating Temperature [Min] | Operating Temperature [Max] | Contact Finish - Mating | Number of Positions Loaded | Termination | Number of Positions | Connector Type | Insulation Height | Insulation Height | Contact Type | Contact Shape | Pitch - Mating | Pitch - Mating | Insulation Color | Insulation Material | Fastening Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Number of Rows | Mounting Type | Contact Material | Voltage Rating | Row Spacing - Mating [x] | Row Spacing - Mating [x] | Current Rating (Amps) | Contact Finish - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Board Guide | -55 °C | 125 °C | Gold | All | Solder | 90 | Receptacle Bottom Entry | 3.66 mm | 0.144 in | Female Socket | Square | 0.1 in | 2.54 mm | Black | Liquid Crystal Polymer (LCP) | Push-Pull | 3 µin | 0.076 µm | 2 | Surface Mount | Beryllium Copper | 400 VAC | 2.54 mm | 0.1 in | 4.1 A | Tin | ||
Samtec Inc. | -55 °C | 125 °C | Gold | All | Solder | 90 | Receptacle Bottom Entry | 3.66 mm | 0.144 in | Female Socket | Square | 0.1 in | 2.54 mm | Black | Liquid Crystal Polymer (LCP) | Push-Pull | 20 µin | 0.51 µm | 2 | Surface Mount | Beryllium Copper | 400 VAC | 2.54 mm | 0.1 in | 4.1 A | Gold | 3 µin | 0.076 µm | |
Samtec Inc. | Board Guide | -55 °C | 125 °C | Gold | All | Solder | 90 | Receptacle | 3.66 mm | 0.144 in | Female Socket | Square | 0.1 in | 2.54 mm | Black | Liquid Crystal Polymer (LCP) | Push-Pull | 20 µin | 0.51 µm | 2 | Surface Mount | Beryllium Copper | 400 VAC | 2.54 mm | 0.1 in | 4.1 A | Gold | 3 µin | 0.076 µm |