Beta
⌘K
CONN IC DIP SOCKET 24POS GOLD
| Part | Housing Material | Contact Material - Mating | Termination Post Length | Termination Post Length | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Post [custom] | Features | Termination | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Type | Type | Type | Pitch - Post | Pitch - Post | Number of Positions or Pins (Grid) | Current Rating (Amps) | Material Flammability Rating | Operating Temperature [Max] | Operating Temperature [Min] | Contact Finish - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Glass Filled Nylon 4/6 Polyamide (PA46) | Beryllium Copper | 3.56 mm | 0.14 in | 0.1 in | 2.54 mm | 200 µin | 5.08 µm | Brass | Closed Frame | Solder | Gold | 30 Áin | 0.76 Ám | DIP | 0.6 in | 15.24 mm | 2.54 mm | 0.1 in | 24 | 3 A | UL94 V-0 | 105 ░C | -55 °C | Tin |