A1F25M12W2-F1 Series
ACEPACK 1 power module, fourpack topology, 1200 V, 25 mOhm typ. SiC MOSFET gen.2 with NTC
Manufacturer: STMicroelectronics
Catalog
ACEPACK 1 power module, fourpack topology, 1200 V, 25 mOhm typ. SiC MOSFET gen.2 with NTC
Key Features
• ACEPACK 1 power module:
- DBC Cu-Al2O3-Cu based
- Insulation voltage UL certified of 2.5 kVrms
- Press-fit contact pins
• Fourpack topology:
- 1200 V SiC MOSFET
- RDS(on)typical 25 mΩ
- Very high-power density
- Very low switching energies
- Switching characteristic almost independent from temperature
Description
AI
This power module features a fourpack topology in an ACEPACK 1 module with NTC and integrates the most advanced silicon carbide MOSFETs of STMicroelectronics which are represented by the gen.2 technology. This modular solution can be used to realize complex topologies characterized by very high power density in order to meet the higest efficiency requirements.