Zenode.ai Logo
Beta
K

SN74AUC2G04 Series

2-ch, 0.8-V to 2.7-V high speed inverters

Manufacturer: Texas Instruments

Catalog

2-ch, 0.8-V to 2.7-V high speed inverters

Key Features

Available in the Texas Instruments NanoStar™ and NanoFree™ PackagesOptimized for 1.8-V Operation and Is 3.6-V I/O Tolerant to Support Mixed-Mode Signal OperationIoffSupports Partial-Power-Down Mode OperationSub 1-V OperableMax tpdof 1.7 ns at 1.8 VLow Power Consumption, 10 µA at 1.8 V±8-mA Output Drive at 1.8 VLatch-Up Performance Exceeds 100 mA Per JESD 78, Class IIESD Protection Exceeds JESD 222000-V Human-Body Model (A114-A)200-V Machine Model (A115-A)1000-V Charged-Device Model (C101)NanoStar and NanoFree are trademarks of Texas Instruments.Available in the Texas Instruments NanoStar™ and NanoFree™ PackagesOptimized for 1.8-V Operation and Is 3.6-V I/O Tolerant to Support Mixed-Mode Signal OperationIoffSupports Partial-Power-Down Mode OperationSub 1-V OperableMax tpdof 1.7 ns at 1.8 VLow Power Consumption, 10 µA at 1.8 V±8-mA Output Drive at 1.8 VLatch-Up Performance Exceeds 100 mA Per JESD 78, Class IIESD Protection Exceeds JESD 222000-V Human-Body Model (A114-A)200-V Machine Model (A115-A)1000-V Charged-Device Model (C101)NanoStar and NanoFree are trademarks of Texas Instruments.

Description

AI
This dual inverter is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCCoperation. The SN74AUC2G04 performs the Boolean function Y = A\. NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. This dual inverter is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCCoperation. The SN74AUC2G04 performs the Boolean function Y = A\. NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.