HLE-130 Series

Catalog

CONN RCPT 60POS 0.1 GOLD PCB

Part	Contact Type	Current Rating (Per Contact)	Insulation Color	Fastening Type	Insulation Height	Contact Finish - Mating	Contact Finish Thickness - Mating	Termination	Operating Temperature (Max)	Operating Temperature (Min)	Row Spacing - Mating	Contact Finish - Post	Number of Positions	Style	Number of Rows	Mounting Type	Contact Length - Post	Number of Positions Loaded	Pitch - Mating	Connector Type	Voltage Rating	Contact Shape	Insulation Material	Contact Material	Features	Contact Finish Thickness - Post
Samtec Inc. HLE-130-02-L-DV-PE	Female Socket	4.1 A	Black	Push-Pull	0.138 in	Gold	10 µin	Solder	125 °C	-55 °C	0.1 in	Tin	60	Board	2	Through Hole	0.09 in	All	0.1 in	Pass Through Receptacle	400 V	Square	Liquid Crystal Polymer (LCP)	Beryllium Copper
Samtec Inc. HLE-130-02-H-DV-A	Female Socket	4.1 A	Black	Push-Pull	0.144 in	Gold	30 µin	Solder	125 °C	-55 °C	0.1 in	Gold	60	Board	2	Surface Mount		All	0.1 in	Receptacle	400 V	Square	Liquid Crystal Polymer (LCP)	Beryllium Copper	Board Guide	3 µin
Samtec Inc. HLE-130-02-SM-DV-PE	Female Socket	4.1 A	Black	Push-Pull	0.138 in	Gold	30 µin	Solder	125 °C	-55 °C	0.1 in	Tin	60	Board	2	Through Hole	0.09 in	All	0.1 in	Pass Through Receptacle	400 V	Square	Liquid Crystal Polymer (LCP)	Beryllium Copper
Samtec Inc. HLE-130-02-G-DV-TE	Female Socket	4.1 A	Black	Push-Pull	0.138 in	Gold	10 µin	Solder	125 °C	-55 °C	0.1 in	Gold	60	Board	2	Through Hole	0.12 in	All	0.1 in	Receptacle	400 V	Square	Liquid Crystal Polymer (LCP)	Beryllium Copper		3 µin
Samtec Inc. HLE-130-02-G-DV	Female Socket	4.1 A	Black	Push-Pull	0.144 in	Gold	20 Ąin	Solder	125 °C	-55 °C	0.1 in	Gold	60	Board	2	Surface Mount		All	0.1 in	Receptacle	400 V	Square	Liquid Crystal Polymer (LCP)	Beryllium Copper		3 µin
Samtec Inc. HLE-130-02-F-DV-BE	Female Socket	4.1 A	Black	Push-Pull	0.144 in	Gold	3 µin	Solder	125 °C	-55 °C	0.1 in	Tin	60	Board	2	Surface Mount		All	0.1 in	Bottom Entry Receptacle	400 V	Square	Liquid Crystal Polymer (LCP)	Beryllium Copper
Samtec Inc. HLE-130-02-S-DV-PE-LC	Female Socket	4.1 A	Black	Push-Pull	0.138 in	Gold	30 µin	Solder	125 °C	-55 °C	0.1 in	Tin	60	Board	2	Through Hole	0.09 in	All	0.1 in	Pass Through Receptacle	400 V	Square	Liquid Crystal Polymer (LCP)	Beryllium Copper	Board Lock
Samtec Inc. HLE-130-02-LM-DV-PE	Female Socket	4.1 A	Black	Push-Pull	0.138 in	Gold	10 µin	Solder	125 °C	-55 °C	0.1 in	Tin	60	Board	2	Through Hole	0.09 in	All	0.1 in	Pass Through Receptacle	400 V	Square	Liquid Crystal Polymer (LCP)	Beryllium Copper
Samtec Inc. HLE-130-02-L-DV-PE-BE	Female Socket	4.1 A	Black	Push-Pull	0.138 in	Gold	10 µin	Solder	125 °C	-55 °C	0.1 in	Tin	60	Board	2	Through Hole	0.09 in	All	0.1 in	Bottom Entry Pass Through Receptacle	400 V	Square	Liquid Crystal Polymer (LCP)	Beryllium Copper
Samtec Inc. HLE-130-02-G-DV-BE-A-K	Female Socket	4.1 A	Black	Push-Pull	0.144 in	Gold	20 Ąin	Solder	125 °C	-55 °C	0.1 in	Gold	60	Board	2	Surface Mount		All	0.1 in	Bottom Entry Receptacle	400 V	Square	Liquid Crystal Polymer (LCP)	Beryllium Copper	Board Guide Pick and Place	3 µin