CONN HEADER SMD 42POS 1.27MM
| Part | Current Rating (Amps) | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Shrouding | Pitch - Mating | Pitch - Mating | Insulation Material | Number of Positions Loaded | Contact Finish - Mating | Material Flammability Rating | Insulation Color | Fastening Type | Insulation Height | Insulation Height | Mounting Type | Number of Positions | Contact Type | Contact Shape | Connector Type | Contact Material | Contact Finish - Post | Termination | Number of Rows | Contact Length - Mating | Contact Length - Mating | Operating Temperature [Min] | Operating Temperature [Max] | Row Spacing - Mating [x] | Row Spacing - Mating [x] | Number of Positions Loaded | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Length - Mating [x] | Features |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 3.1 A | 10 çin | 0.25 çm | Unshrouded | 0.05 in | 1.27 mm | Liquid Crystal Polymer (LCP) | All | Gold | UL94 V-0 | Black | Push-Pull | 0.1 in | 2.54 mm | Surface Mount | 42 | Male Pin | Square | Header | Phosphor Bronze | Tin | Solder | 2 | 0.1 in | 2.54 mm | -55 °C | 125 °C | 2.54 mm | 0.1 in | |||||
Samtec Inc. | 3.1 A | 10 çin | 0.25 çm | Unshrouded | 0.05 in | 1.27 mm | Liquid Crystal Polymer (LCP) | Gold | UL94 V-0 | Black | Push-Pull | 0.1 in | 2.54 mm | Surface Mount | 21 | Male Pin | Square | Header | Phosphor Bronze | Tin | Solder | 1 | 0.19 " | 4.83 mm | -55 °C | 125 °C | 20 | |||||||
Samtec Inc. | 3.1 A | 10 çin | 0.25 çm | Unshrouded | 0.05 in | 1.27 mm | Liquid Crystal Polymer (LCP) | All | Gold | UL94 V-0 | Black | Push-Pull | 0.1 in | 2.54 mm | Surface Mount | 21 | Male Pin | Square | Header | Phosphor Bronze | Gold | Solder | 1 | 5.84 mm | -55 °C | 125 °C | 3 µin | 0.076 µm | 0.23 in | Pick and Place | ||||
Samtec Inc. | 3.1 A | 30 Áin | 0.76 Ám | Unshrouded | 0.05 in | 1.27 mm | Liquid Crystal Polymer (LCP) | All | Gold | UL94 V-0 | Black | Push-Pull | 0.1 in | 2.54 mm | Surface Mount | 21 | Male Pin | Square | Header | Phosphor Bronze | Tin | Solder | 1 | 5.84 mm | -55 °C | 125 °C | 0.23 in | |||||||
Samtec Inc. | 3.1 A | Unshrouded | 0.05 in | 1.27 mm | Liquid Crystal Polymer (LCP) | All | UL94 V-0 | Black | Push-Pull | 0.1 in | 2.54 mm | Surface Mount | 42 | Male Pin | Square | Header | Phosphor Bronze | Tin | Solder | 2 | 5.84 mm | -55 °C | 125 °C | 2.54 mm | 0.1 in | 0.23 in | Board Guide | |||||||
Samtec Inc. | 3.1 A | 10 çin | 0.25 çm | Unshrouded | 0.05 in | 1.27 mm | Liquid Crystal Polymer (LCP) | All | Gold | UL94 V-0 | Black | Push-Pull | 0.1 in | 2.54 mm | Surface Mount | 21 | Male Pin | Square | Header | Phosphor Bronze | Gold | Solder | 1 | 0.285 in | 7.24 mm | -55 °C | 125 °C | 3 µin | 0.076 µm | |||||
Samtec Inc. | 3.1 A | Unshrouded | 0.05 in | 1.27 mm | Liquid Crystal Polymer (LCP) | All | UL94 V-0 | Black | Push-Pull | 0.1 in | 2.54 mm | Surface Mount | 21 | Male Pin | Square | Header | Phosphor Bronze | Tin | Solder | 1 | 0.125 in | 3.18 mm | -55 °C | 125 °C | ||||||||||
Samtec Inc. | 3.1 A | 10 çin | 0.25 çm | Unshrouded | 0.05 in | 1.27 mm | Liquid Crystal Polymer (LCP) | All | Gold | UL94 V-0 | Black | Push-Pull | 0.1 in | 2.54 mm | Surface Mount | 21 | Male Pin | Square | Header | Phosphor Bronze | Gold | Solder | 1 | 5.84 mm | -55 °C | 125 °C | 3 µin | 0.076 µm | 0.23 in | |||||
Samtec Inc. | 3.1 A | 10 çin | 0.25 çm | Unshrouded | 0.05 in | 1.27 mm | Liquid Crystal Polymer (LCP) | All | Gold | UL94 V-0 | Black | Push-Pull | 0.1 in | 2.54 mm | Surface Mount | 21 | Male Pin | Square | Header | Phosphor Bronze | Gold | Solder | 1 | 0.19 " | 4.83 mm | -55 °C | 125 °C | 3 µin | 0.076 µm | |||||
Samtec Inc. | 3.1 A | 30 Áin | 0.76 Ám | Unshrouded | 0.05 in | 1.27 mm | Liquid Crystal Polymer (LCP) | All | Gold | UL94 V-0 | Black | Push-Pull | 0.1 in | 2.54 mm | Surface Mount | 21 | Male Pin | Square | Header | Phosphor Bronze | Tin | Solder | 1 | 0.285 in | 7.24 mm | -55 °C | 125 °C |