MIC5399 Series
Manufacturer: Microchip Technology
IC REG LINEAR 1.8V/2.8V 8DFN
| Part | Control Features | Current - Output | Operating Temperature (Max) | Operating Temperature (Min) | Current - Quiescent (Iq) | Package / Case | Voltage - Input (Max) | Package Name | Package Width | Package Length | Protection Features | Mounting Type | Number of Regulators | Current - Supply (Max) | PSRR | Output Type | Output Configuration | Voltage Dropout (Max) | Voltage - Output (Fixed) | Voltage - Output (Min) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology | Enable | 300 mA | 125 °C | -40 °C | 55 µA | 8-XFDFN Exposed Pad | 5.5 V | 8-DFN | 1.2 mm | 1.6 mm | Over Current Over Temperature | Surface Mount | 2 | 130 µA | 60 dB | Fixed | Positive | 0.38 V | 2.8 V | 1.8 V |
Microchip Technology | Enable | 300 mA | 125 °C | -40 °C | 55 µA | 8-XFDFN Exposed Pad | 5.5 V | 8-DFN | 1.6 mm | 1.2 mm | Over Current Over Temperature | Surface Mount | 2 | 130 µA | 60 dB | Fixed | Positive | 0.38 V | 3.3 V | 1.8 V |
Microchip Technology | Enable | 300 mA | 125 °C | -40 °C | 55 µA | 8-XFDFN Exposed Pad | 5.5 V | 8-DFN | 1.6 mm | 1.2 mm | Over Current Over Temperature | Surface Mount | 2 | 130 µA | 60 dB | Fixed | Positive | 0.38 V | 2.8 V | 1.8 V |
Microchip Technology | Enable | 300 mA | 125 °C | -40 °C | 55 µA | 8-XFDFN Exposed Pad | 5.5 V | 8-XTDFN | 1.6 mm | 1.2 mm | Over Current Over Temperature | Surface Mount | 2 | 130 µA | 60 dB | Fixed | Positive | 0.38 V | 3.3 V | 2.8 V |
Microchip Technology | Enable | 300 mA | 125 °C | -40 °C | 55 µA | 8-XFDFN Exposed Pad | 5.5 V | 8-TDFN | 1.6 mm | 1.2 mm | Over Current Over Temperature | Surface Mount | 2 | 130 µA | 60 dB | Fixed | Positive | 0.38 V | 2.8 V | 2.8 V |
Microchip Technology | Enable | 300 mA | 125 °C | -40 °C | 55 µA | 8-XFDFN Exposed Pad | 5.5 V | 8-DFN | 1.6 mm | 1.2 mm | Over Current Over Temperature | Surface Mount | 2 | 130 µA | 60 dB | Fixed | Positive | 0.38 V | 3.3 V | 3.3 V |
Microchip Technology | Enable | 300 mA | 125 °C | -40 °C | 55 µA | 8-XFDFN Exposed Pad | 5.5 V | 8-DFN | 1.6 mm | 1.2 mm | Over Current Over Temperature | Surface Mount | 2 | 130 µA | 60 dB | Fixed | Positive | 0.38 V | 3.3 V | 1.8 V |
Microchip Technology | Enable | 300 mA | 125 °C | -40 °C | 55 µA | 8-XFDFN Exposed Pad | 5.5 V | 8-DFN | 1.6 mm | 1.2 mm | Over Current Over Temperature | Surface Mount | 2 | 130 µA | 60 dB | Fixed | Positive | 0.38 V | 2.8 V | 1.8 V |
Microchip Technology | Enable | 300 mA | 125 °C | -40 °C | 55 µA | 8-XFDFN Exposed Pad | 5.5 V | 8-DFN | 1.2 mm | 1.6 mm | Over Current Over Temperature | Surface Mount | 2 | 130 µA | 60 dB | Fixed | Positive | 0.38 V | 2.8 V | 1.8 V |
Microchip Technology | Enable | 300 mA | 125 °C | -40 °C | 55 µA | 8-XFDFN Exposed Pad | 5.5 V | 8-DFN | 1.6 mm | 1.2 mm | Over Current Over Temperature | Surface Mount | 2 | 130 µA | 60 dB | Fixed | Positive | 0.38 V | 3.3 V | 2.8 V |