DSC1121 Series
Manufacturer: Microchip Technology
MEMS OSC XO 127.0000MHZ CMOS SMD
| Part | Current - Supply (Disable) (Max) | Size / Dimension Width | Size / Dimension Length | Current - Supply (Max) | Package Width | Package Name | Package Length | Frequency | Function | Type | Voltage - Supply (Maximum) | Voltage - Supply (Minimum) | Base Resonator | Output | Height - Seated (Max) | Mounting Type | Frequency Stability | Operating Temperature (Min) | Operating Temperature (Max) | Package / Case | Ratings |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology | 22 mA | 0.079 in | 0.098 in | 35 mA | 2 mm | 6-VDFN | 2.5 mm | 127 MHz | Disable Enable | XO (Standard) | 3.6 V | 2.25 V | MEMS | CMOS | 0.035 in | Surface Mount | 25 ppm | -40 °C | 105 °C | 6-VDFN | AEC-Q100 |
Microchip Technology | 22 mA | 0.098 in | 0.126 in | 35 mA | 2.5 mm | 6-VDFN | 3.2 mm | 24 MHz | Disable Enable | XO (Standard) | 3.6 V | 2.25 V | MEMS | CMOS | 0.035 in | Surface Mount | 50 ppm | -55 °C | 125 °C | 6-SMD 6-VDFN No Lead | AEC-Q100 |
Microchip Technology | 22 mA | 0.197 in | 0.276 in | 35 mA | 5 mm | 6-VDFN | 7 mm | 25 MHz | Disable Enable | XO (Standard) | 3.6 V | 2.25 V | MEMS | CMOS | 0.035 in | Surface Mount | 25 ppm | -55 °C | 125 °C | 6-SMD 6-VDFN Exposed Pad No Lead Exposed Pad | AEC-Q100 |
Microchip Technology | 22 mA | 0.079 in | 0.098 in | 35 mA | 2 mm | 6-VDFN | 2.5 mm | 35 MHz | Disable Enable | XO (Standard) | 3.6 V | 2.25 V | MEMS | CMOS | 0.035 in | Surface Mount | 10 ppm | -40 °C | 105 °C | 6-VDFN | |
Microchip Technology | 22 mA | 0.098 in | 0.126 in | 35 mA | 2.5 mm | 6-VDFN | 3.2 mm | 24.75 MHz | Disable Enable | XO (Standard) | 3.6 V | 2.25 V | MEMS | CMOS | 0.035 in | Surface Mount | 25 ppm | -40 °C | 105 °C | 6-VDFN | |
Microchip Technology | 0.197 in | 0.276 in | 22 mA 35 mA | 5 mm | 6-VDFN | 7 mm | 8 MHz | Disable Enable | XO (Standard) | 3.6 V | 2.25 V | MEMS | CMOS | 0.035 in | Surface Mount | 25 ppm | -55 °C | 125 °C | 6-SMD 6-VDFN Exposed Pad No Lead Exposed Pad | ||
Microchip Technology | 22 mA | 0.197 in | 0.276 in | 35 mA | 5 mm | 6-VDFN | 7 mm | 22.5792 MHz | Disable Enable | XO (Standard) | 3.6 V | 2.25 V | MEMS | CMOS | 0.035 in | Surface Mount | 10 ppm | -40 °C | 85 °C | 6-VDFN Exposed Pad | |
Microchip Technology | 22 mA | 0.098 in | 0.126 in | 35 mA | 2.5 mm | 6-VDFN | 3.2 mm | 12.288 MHz | Disable Enable | XO (Standard) | 3.6 V | 2.25 V | MEMS | CMOS | 0.035 in | Surface Mount | 10 ppm | -20 °C | 70 °C | 6-VDFN | |
Microchip Technology | 22 mA | 0.098 in | 0.126 in | 35 mA | 2.5 mm | 6-VDFN | 3.2 mm | 125 MHz | Disable Enable | XO (Standard) | 3.6 V | 2.25 V | MEMS | CMOS | 0.035 in | Surface Mount | 25 ppm | -40 °C | 85 °C | 6-VDFN | AEC-Q100 |
Microchip Technology | 22 mA | 0.098 in | 0.126 in | 35 mA | 2.5 mm | 6-VDFN | 3.2 mm | 40 MHz | Disable Enable | XO (Standard) | 3.6 V | 2.25 V | MEMS | CMOS | 0.035 in | Surface Mount | 25 ppm | -40 °C | 105 °C | 6-VDFN | AEC-Q100 |