16-3508 Series

Catalog

CONN IC DIP SOCKET 16POS GOLD

Part	Contact Material - Mating	Current Rating (Amps)	Material Flammability Rating	Contact Material - Post [custom]	Termination Post Length	Termination Post Length	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Housing Material	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish - Mating	Features	Termination	Pitch - Mating	Pitch - Mating	Pitch - Post	Pitch - Post	Type	Type	Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Mounting Type	Number of Positions or Pins (Grid)	Contact Finish - Post	Termination Post Length [x]	Termination Post Length [x]
Aries Electronics 16-3508-311	Beryllium Copper	3 A	UL94 V-0	Brass	0.5 in	12.7 mm	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)	-55 °C	125 °C	Gold	Open Frame	Wire Wrap	0.1 in	2.54 mm	2.54 mm	0.1 in	0.3 "	7.62 mm	DIP	30 Áin	0.76 Ám	Through Hole	16	Gold
Aries Electronics 16-3508-302	Beryllium Copper	3 A	UL94 V-0	Brass			200 µin	5.08 µm	Glass Filled Nylon 4/6 Polyamide (PA46)	-55 °C	105 ░C	Gold	Open Frame	Wire Wrap	0.1 in	2.54 mm	2.54 mm	0.1 in	0.3 "	7.62 mm	DIP	30 Áin	0.76 Ám	Through Hole	16	Tin	0.36 in	9.14 mm
Aries Electronics 16-3508-31	Beryllium Copper	3 A	UL94 V-0	Brass	0.5 in	12.7 mm	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)	-55 °C	125 °C	Gold	Open Frame	Wire Wrap	0.1 in	2.54 mm	2.54 mm	0.1 in	0.3 "	7.62 mm	DIP	30 Áin	0.76 Ám	Through Hole	16	Gold