TMM-126 Series
Manufacturer: Samtec Inc.
CONN HEADER SMD 26POS 2MM
| Part | Contact Length - Mating | Mounting Type | Pitch - Mating | Contact Finish - Mating | Material Flammability Rating | Insulation Height | Current Rating (Per Contact) | Fastening Type | Contact Material | Shrouding | Number of Positions | Contact Finish - Post | Insulation Material | Contact Type | Termination | Connector Type | Insulation Color | Contact Finish Thickness - Mating | Number of Positions Loaded | Operating Temperature (Max) | Operating Temperature (Min) | Contact Shape | Number of Rows | Style | Features | Row Spacing - Mating | Contact Length - Post | Overall Contact Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 0.126 in | Surface Mount | 0.079 in | Gold | UL94 V-0 | 0.059 in | 3.2 A | Push-Pull | Phosphor Bronze | Unshrouded | 26 | Tin | Liquid Crystal Polymer (LCP) | Male Pin | Solder | Header | Black | 30 µin | All | 125 °C | -55 °C | Square | 1 | Board Board or Cable | ||||
Samtec Inc. | 0.126 in | Surface Mount | 0.079 in | Gold | UL94 V-0 | 0.059 in | 3.2 A | Push-Pull | Phosphor Bronze | Unshrouded | 52 | Tin | Liquid Crystal Polymer (LCP) | Male Pin | Solder | Header | Black | 30 µin | All | 125 °C | -55 °C | Square | 2 | Board Board or Cable | Pick and Place | 0.079 in | ||
Samtec Inc. | 0.126 in | Right Angle Through Hole | 0.079 in | Gold | 0.155 in | 3.2 A | Push-Pull | Phosphor Bronze | Unshrouded | 52 | Tin | Liquid Crystal Polymer (LCP) | Male Pin | Solder | Header | Black | 30 µin | All | 125 °C | -55 °C | Square | 2 | Board Board or Cable | 0.079 in | 0.12 in | |||
Samtec Inc. | 0.126 in | Through Hole | 0.079 in | Gold | 0.059 in | 3.2 A | Push-Pull | Phosphor Bronze | Unshrouded | 52 | Tin | Liquid Crystal Polymer (LCP) | Male Pin | Solder | Header | Black | 30 µin | All | 125 °C | -55 °C | Square | 2 | Board Board or Cable | 0.079 in | 0.138 in | 0.323 in | ||
Samtec Inc. | 0.157 in | Through Hole | 0.079 in | Gold | 0.059 in | 3.2 A | Push-Pull | Phosphor Bronze | Unshrouded | 52 | Tin | Liquid Crystal Polymer (LCP) | Male Pin | Solder | Header | Black | 10 µin | All | 125 °C | -55 °C | Square | 2 | Board Board or Cable | 0.079 in | 0.106 in | 0.323 in | ||
Samtec Inc. | 0.126 in | Right Angle Through Hole | 0.079 in | Gold | 0.155 in | 3.2 A | Push-Pull | Phosphor Bronze | Unshrouded | 52 | Tin | Liquid Crystal Polymer (LCP) | Male Pin | Solder | Header | Black | 3 µin | All | 125 °C | -55 °C | Square | 2 | Board Board or Cable | 0.079 in | 0.12 in | |||
Samtec Inc. | 0.126 in | Right Angle Through Hole | 0.079 in | Tin | 0.079 in | 3.2 A | Push-Pull | Phosphor Bronze | Unshrouded | 26 | Tin | Liquid Crystal Polymer (LCP) | Male Pin | Solder | Header | Black | All | 105 °C | -55 °C | Square | 1 | Board Board or Cable | 0.12 in | |||||
Samtec Inc. | 0.157 in | Through Hole | 0.079 in | Gold | 0.059 in | 3.2 A | Push-Pull | Phosphor Bronze | Unshrouded | 26 | Tin | Liquid Crystal Polymer (LCP) | Male Pin | Solder | Header | Black | 10 µin | All | 125 °C | -55 °C | Square | 1 | Board Board or Cable | 0.106 in | 0.323 in | |||
Samtec Inc. | 0.126 in | Through Hole | 0.079 in | Gold | 0.059 in | 3.2 A | Push-Pull | Phosphor Bronze | Unshrouded | 26 | Tin | Liquid Crystal Polymer (LCP) | Male Pin | Solder | Header | Black | 10 µin | All | 125 °C | -55 °C | Square | 1 | Board Board or Cable | 0.138 in | 0.323 in | |||
Samtec Inc. | 0.126 in | Right Angle Through Hole | 0.079 in | Gold | 0.315 in | 3.2 A | Push-Pull | Phosphor Bronze | Unshrouded | 104 | Tin | Liquid Crystal Polymer (LCP) | Male Pin | Solder | Header | Black | 10 µin | All | 125 °C | -55 °C | Square | 4 | Board Board or Cable | 0.079 in | 0.12 in |