CONN HEADER SMD 4POS 1MM
| Part | Row Spacing - Mating | Row Spacing - Mating | Number of Positions | Contact Type | Contact Length - Mating | Contact Length - Mating | Current Rating (Amps) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Number of Positions Loaded | Operating Temperature [Min] | Operating Temperature [Max] | Termination | Contact Material | Shrouding | Insulation Height | Insulation Height | Pitch - Mating | Pitch - Mating | Connector Type | Contact Finish - Post | Insulation Color | Number of Rows | Insulation Material | Mounting Type | Fastening Type | Contact Shape | Contact Length - Mating [x] | Contact Length - Mating [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 0.039 " | 1 mm | 4 | Male Pin | 0.065 in | 1.65 mm | 2.8 A per Contact | Gold | 3 µin | 0.076 µm | All | -55 °C | 125 °C | Solder | Phosphor Bronze | Unshrouded | 0.038 in | 0.97 mm | 0.039 in | 1 mm | Cuttable Header | Tin | Black | 2 | Liquid Crystal Polymer (LCP) | Surface Mount | Push-Pull | Square | ||
Samtec Inc. | 0.039 " | 1 mm | 4 | Male Pin | 2.8 A per Contact | Gold | 3 µin | 0.076 µm | All | -55 °C | 125 °C | Solder | Phosphor Bronze | Unshrouded | 0.038 in | 0.97 mm | 0.039 in | 1 mm | Cuttable Header | Tin | Black | 2 | Liquid Crystal Polymer (LCP) | Surface Mount | Push-Pull | Square | 1.9 mm | 0.075 in | ||
Samtec Inc. | 0.039 " | 1 mm | 4 | Male Pin | 0.065 in | 1.65 mm | 2.8 A per Contact | Gold | 10 çin | 0.25 çm | All | -55 °C | 125 °C | Solder | Phosphor Bronze | Unshrouded | 0.038 in | 0.97 mm | 0.039 in | 1 mm | Cuttable Header | Tin | Black | 2 | Liquid Crystal Polymer (LCP) | Surface Mount | Push-Pull | Square |