XCV300 Series
Manufacturer: AMD / Xilinx
IC FPGA 312 I/O 456FBGA
| Part | Mounting Type | Voltage - Supply (Maximum) | Voltage - Supply (Minimum) | Package / Case | Package Width | Package Name | Package Length | Number of I/O | Operating Temperature (Max) | Operating Temperature (Min) | Number of Gates | Number of Logic Elements/Cells | Number of LABs/CLBs | Total RAM Bits |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
AMD / Xilinx | Surface Mount | 2.625 V | 2.375 V | 456-BBGA | 23 mm | 456-FBGA | 23 mm | 312 | 85 °C | 0 °C | 322970 | 6912 | 1536 | 65536 bits |
AMD / Xilinx | Surface Mount | 2.625 V | 2.375 V | 456-BBGA | 23 mm | 456-FBGA | 23 mm | 312 | 100 °C | -40 °C | 322970 | 6912 | 1536 | 65536 bits |
AMD / Xilinx | Surface Mount | 2.625 V | 2.375 V | 240-BFQFP | 32 mm | 240-PQFP | 32 mm | 166 | 100 °C | -40 °C | 322970 | 6912 | 1536 | 65536 bits |
AMD / Xilinx | Surface Mount | 2.625 V | 2.375 V | 432-LBGA Exposed Pad Metal | 40 mm | 432-MBGA | 40 mm | 316 | 85 °C | 0 °C | 322970 | 6912 | 1536 | 65536 bits |
AMD / Xilinx | Surface Mount | 2.625 V | 2.375 V | 456-BBGA | 23 mm | 456-FBGA | 23 mm | 312 | 85 °C | 0 °C | 322970 | 6912 | 1536 | 65536 bits |
AMD / Xilinx | Surface Mount | 2.625 V | 2.375 V | 432-LBGA Exposed Pad Metal | 40 mm | 432-MBGA | 40 mm | 316 | 100 °C | -40 °C | 322970 | 6912 | 1536 | 65536 bits |
AMD / Xilinx | Surface Mount | 2.625 V | 2.375 V | 432-LBGA Exposed Pad Metal | 40 mm | 432-MBGA | 40 mm | 316 | 85 °C | 0 °C | 322970 | 6912 | 1536 | 65536 bits |
AMD / Xilinx | Surface Mount | 2.625 V | 2.375 V | 352-LBGA Exposed Pad Metal | 35 mm | 352-MBGA | 35 mm | 260 | 85 °C | 0 °C | 322970 | 6912 | 1536 | 65536 bits |
AMD / Xilinx | Surface Mount | 2.625 V | 2.375 V | 352-LBGA Exposed Pad Metal | 35 mm | 352-MBGA | 35 mm | 260 | 85 °C | 0 °C | 322970 | 6912 | 1536 | 65536 bits |
AMD / Xilinx | Surface Mount | 2.625 V | 2.375 V | 352-LBGA Exposed Pad Metal | 35 mm | 352-MBGA | 35 mm | 260 | 85 °C | 0 °C | 322970 | 6912 | 1536 | 65536 bits |