27-0518 Series

Catalog

CONN SOCKET SIP 27POS GOLD

Part	Mounting Type	Pitch - Post	Pitch - Post	Contact Finish - Mating	Material Flammability Rating	Contact Material - Mating	Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Housing Material	Termination	Pitch - Mating	Pitch - Mating	Contact Finish - Post	Termination Post Length	Termination Post Length	Current Rating (Amps)	Number of Positions or Pins (Grid)	Contact Material - Post [custom]	Features	Termination Post Length [x]	Termination Post Length [x]
Aries Electronics 27-0518-10H	Through Hole	2.54 mm	0.1 in	Gold	UL94 V-0	Beryllium Copper	SIP	200 µin	5.08 µm	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)	Solder	0.1 in	2.54 mm	Tin	3.18 mm	0.125 in	3 A	27	Brass	Open Frame
Aries Electronics 27-0518-00	Surface Mount	2.54 mm	0.1 in	Gold	UL94 V-0	Beryllium Copper	SIP	200 µin	5.08 µm	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)	Solder	0.1 in	2.54 mm	Tin			3 A	27	Brass	Open Frame	0.046 in	1.17 mm
Aries Electronics 27-0518-10	Through Hole	2.54 mm	0.1 in	Gold	UL94 V-0	Beryllium Copper	SIP	200 µin	5.08 µm	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)	Solder	0.1 in	2.54 mm	Tin	3.18 mm	0.125 in	3 A	27	Brass	Open Frame
Aries Electronics 27-0518-11H	Through Hole	2.54 mm	0.1 in	Gold	UL94 V-0	Beryllium Copper	SIP	10 çin	0.25 çm	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)	Solder	0.1 in	2.54 mm	Gold	3.18 mm	0.125 in	3 A	27	Brass	Open Frame