28-3508 Series
Manufacturer: Aries Electronics
CONN IC DIP SOCKET 28POS GOLD
| Part | Current Rating | Material Flammability Rating | Termination Post Length | Contact Finish - Post | Contact Material - Mating | Pitch - Post | Contact Finish Thickness - Mating | Operating Temperature (Min) | Operating Temperature (Max) | Pitch - Mating | Contact Material - Post | Termination | Contact Finish - Mating | Row Spacing | Type | Housing Material | Features | Grid Columns | Number of Positions or Pins (Grid) | Grid Rows | Contact Finish Thickness - Post | Mounting Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 3 A | UL94 V-0 | 0.36 in | Tin | Beryllium Copper | 0.1 in | 30 µin | -55 °C | 105 °C | 0.1 in | Brass | Wire Wrap | Gold | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | Glass Filled Nylon 4/6 PA46 Polyamide | Open Frame | 14 | 28 | 2 | 200 µin | Through Hole |
Aries Electronics | 3 A | UL94 V-0 | 0.5 in | Gold | Beryllium Copper | 0.1 in | 30 µin | -55 °C | 125 °C | 0.1 in | Brass | Wire Wrap | Gold | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | Glass Filled Nylon 4/6 PA46 Polyamide | Open Frame | 14 | 28 | 2 | 10 µin | Through Hole |
Aries Electronics | 3 A | UL94 V-0 | 0.5 in | Gold | Beryllium Copper | 0.1 in | 30 µin | -55 °C | 125 °C | 0.1 in | Brass | Wire Wrap | Gold | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | Glass Filled Nylon 4/6 PA46 Polyamide | Open Frame | 14 | 28 | 2 | 10 µin | Through Hole |
Aries Electronics | 3 A | UL94 V-0 | 0.36 in | Tin | Beryllium Copper | 0.1 in | 30 µin | -55 °C | 105 °C | 0.1 in | Brass | Wire Wrap | Gold | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | Glass Filled Nylon 4/6 PA46 Polyamide | Open Frame | 14 | 28 | 2 | 200 µin | Through Hole |
Aries Electronics | 3 A | UL94 V-0 | 0.5 in | Gold | Beryllium Copper | 0.1 in | 30 µin | -55 °C | 125 °C | 0.1 in | Brass | Wire Wrap | Gold | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | Glass Filled Nylon 4/6 PA46 Polyamide | Open Frame | 14 | 28 | 2 | 10 µin | Through Hole |
Aries Electronics | 3 A | UL94 V-0 | 0.36 in | Tin | Beryllium Copper | 0.1 in | 30 µin | -55 °C | 105 °C | 0.1 in | Brass | Wire Wrap | Gold | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | Glass Filled Nylon 4/6 PA46 Polyamide | Open Frame | 14 | 28 | 2 | 200 µin | Through Hole |
Aries Electronics | 3 A | UL94 V-0 | 0.5 in | Gold | Beryllium Copper | 0.1 in | 30 µin | -55 °C | 125 °C | 0.1 in | Brass | Wire Wrap | Gold | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | Glass Filled Nylon 4/6 PA46 Polyamide | Open Frame | 14 | 28 | 2 | 10 µin | Through Hole |
Aries Electronics | 3 A | UL94 V-0 | 0.5 in | Gold | Beryllium Copper | 0.1 in | 30 µin | -55 °C | 125 °C | 0.1 in | Brass | Wire Wrap | Gold | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | Glass Filled Nylon 4/6 PA46 Polyamide | Open Frame | 14 | 28 | 2 | 10 µin | Through Hole |