28-3508 Series

Catalog

CONN IC DIP SOCKET 28POS GOLD

Part	Pitch - Post	Pitch - Post	Contact Finish - Post	Operating Temperature [Max]	Operating Temperature [Min]	Pitch - Mating	Pitch - Mating	Contact Material - Post [custom]	Current Rating (Amps)	Features	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Termination	Termination Post Length [x]	Termination Post Length [x]	Number of Positions or Pins (Grid)	Mounting Type	Type	Type	Type	Contact Finish - Mating	Material Flammability Rating	Housing Material	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Termination Post Length	Termination Post Length
Aries Electronics 28-3508-302	2.54 mm	0.1 in	Tin	105 ░C	-55 °C	0.1 in	2.54 mm	Brass	3 A	Open Frame	200 µin	5.08 µm	Wire Wrap	0.36 in	9.14 mm	28	Through Hole	0.3 "	7.62 mm	DIP	Gold	UL94 V-0	Glass Filled Nylon 4/6 Polyamide (PA46)	30 Áin	0.76 Ám	Beryllium Copper
Aries Electronics 28-3508-31	2.54 mm	0.1 in	Gold	125 °C	-55 °C	0.1 in	2.54 mm	Brass	3 A	Open Frame	10 çin	0.25 çm	Wire Wrap			28	Through Hole	0.3 "	7.62 mm	DIP	Gold	UL94 V-0	Glass Filled Nylon 4/6 Polyamide (PA46)	30 Áin	0.76 Ám	Beryllium Copper	0.5 in	12.7 mm
Aries Electronics 28-3508-21	2.54 mm	0.1 in	Gold	125 °C	-55 °C	0.1 in	2.54 mm	Brass	3 A	Open Frame	10 çin	0.25 çm	Wire Wrap			28	Through Hole	0.3 "	7.62 mm	DIP	Gold	UL94 V-0	Glass Filled Nylon 4/6 Polyamide (PA46)	30 Áin	0.76 Ám	Beryllium Copper	0.5 in	12.7 mm
Aries Electronics 28-3508-30	2.54 mm	0.1 in	Tin	105 ░C	-55 °C	0.1 in	2.54 mm	Brass	3 A	Open Frame	200 µin	5.08 µm	Wire Wrap	0.36 in	9.14 mm	28	Through Hole	0.3 "	7.62 mm	DIP	Gold	UL94 V-0	Glass Filled Nylon 4/6 Polyamide (PA46)	30 Áin	0.76 Ám	Beryllium Copper
Aries Electronics 28-3508-311	2.54 mm	0.1 in	Gold	125 °C	-55 °C	0.1 in	2.54 mm	Brass	3 A	Open Frame	10 çin	0.25 çm	Wire Wrap			28	Through Hole	0.3 "	7.62 mm	DIP	Gold	UL94 V-0	Glass Filled Nylon 4/6 Polyamide (PA46)	30 Áin	0.76 Ám	Beryllium Copper	0.5 in	12.7 mm
Aries Electronics 28-3508-202	2.54 mm	0.1 in	Tin	105 ░C	-55 °C	0.1 in	2.54 mm	Brass	3 A	Open Frame	200 µin	5.08 µm	Wire Wrap	0.36 in	9.14 mm	28	Through Hole	0.3 "	7.62 mm	DIP	Gold	UL94 V-0	Glass Filled Nylon 4/6 Polyamide (PA46)	30 Áin	0.76 Ám	Beryllium Copper
Aries Electronics 28-3508-312	2.54 mm	0.1 in	Gold	125 °C	-55 °C	0.1 in	2.54 mm	Brass	3 A	Open Frame	10 çin	0.25 çm	Wire Wrap			28	Through Hole	0.3 "	7.62 mm	DIP	Gold	UL94 V-0	Glass Filled Nylon 4/6 Polyamide (PA46)	30 Áin	0.76 Ám	Beryllium Copper	0.5 in	12.7 mm
Aries Electronics 28-3508-212	2.54 mm	0.1 in	Gold	125 °C	-55 °C	0.1 in	2.54 mm	Brass	3 A	Open Frame	10 çin	0.25 çm	Wire Wrap			28	Through Hole	0.3 "	7.62 mm	DIP	Gold	UL94 V-0	Glass Filled Nylon 4/6 Polyamide (PA46)	30 Áin	0.76 Ám	Beryllium Copper	0.5 in	12.7 mm