ESQT-136 Series

Catalog

CONN SOCKET 72POS 0.079 GOLD PCB

Part	Mounting Type	Termination	Fastening Type	Row Spacing - Mating	Material Flammability Rating	Contact Length - Post	Current Rating (Per Contact)	Number of Positions Loaded	Contact Finish - Post	Insulation Height	Operating Temperature (Max)	Operating Temperature (Min)	Contact Finish Thickness - Mating	Style	Pitch - Mating	Connector Type	Contact Type	Contact Finish - Mating	Insulation Color	Number of Rows	Number of Positions	Insulation Material	Contact Shape	Contact Material	Contact Finish Thickness - Post
Samtec Inc. ESQT-136-02-F-D-309	Through Hole	Solder	Push-Pull	0.079 in	UL94 V-0	0.541 in	4.5 A	All	Tin	0.309 in	125 °C	-55 °C	3 µin	Board Board or Cable	0.079 in	Elevated Socket	Forked	Gold	Black	2	72	Liquid Crystal Polymer (LCP)	Square	Phosphor Bronze
Samtec Inc. ESQT-136-02-F-5-750	Through Hole	Solder	Push-Pull	0.079 in	UL94 V-0	0.1 in	4.5 A	All	Tin	0.75 in	125 °C	-55 °C	3 µin	Board Board or Cable	0.079 in	Elevated Socket	Forked	Gold	Black	5	180	Liquid Crystal Polymer (LCP)	Square	Phosphor Bronze
Samtec Inc. ESQT-136-02-M-Q-710	Through Hole	Solder	Push-Pull	0.079 in	UL94 V-0	0.14 in	4.5 A	All	Tin	0.71 in	125 °C	-55 °C	20 Ąin	Board Board or Cable	0.079 in	Elevated Socket	Forked	Gold	Black	4	144	Liquid Crystal Polymer (LCP)	Square	Phosphor Bronze
Samtec Inc. ESQT-136-02-G-Q-370	Through Hole	Solder	Push-Pull	0.079 in	UL94 V-0	0.48 in	4.5 A	All	Gold	0.37 in	125 °C	-55 °C	20 Ąin	Board Board or Cable	0.079 in	Elevated Socket	Forked	Gold	Black	4	144	Liquid Crystal Polymer (LCP)	Square	Phosphor Bronze	3 µin
Samtec Inc. ESQT-136-03-F-S-365	Through Hole	Solder	Push-Pull		UL94 V-0	0.093 in	4.5 A	All	Tin	0.365 in	125 °C	-55 °C	3 µin	Board Board or Cable	0.079 in	Elevated Socket	Forked	Gold	Black	1	36	Liquid Crystal Polymer (LCP)	Square	Phosphor Bronze
Samtec Inc. ESQT-136-03-G-Q-370	Through Hole	Solder	Push-Pull	0.079 in	UL94 V-0	0.088 in	4.5 A	All	Gold	0.37 in	125 °C	-55 °C	20 Ąin	Board Board or Cable	0.079 in	Elevated Socket	Forked	Gold	Black	4	144	Liquid Crystal Polymer (LCP)	Square	Phosphor Bronze	3 µin
Samtec Inc. ESQT-136-03-G-D-375	Through Hole	Solder	Push-Pull	0.079 in	UL94 V-0	0.083 in	4.5 A	All	Gold	0.375 in	125 °C	-55 °C	20 Ąin	Board Board or Cable	0.079 in	Elevated Socket	Forked	Gold	Black	2	72	Liquid Crystal Polymer (LCP)	Square	Phosphor Bronze	3 µin
Samtec Inc. ESQT-136-03-G-Q-368	Through Hole	Solder	Push-Pull	0.079 in	UL94 V-0	0.09 in	4.5 A	All	Gold	0.368 in	125 °C	-55 °C	20 Ąin	Board Board or Cable	0.079 in	Elevated Socket	Forked	Gold	Black	4	144	Liquid Crystal Polymer (LCP)	Square	Phosphor Bronze	3 µin
Samtec Inc. ESQT-136-02-S-Q-750	Through Hole	Solder	Push-Pull	0.079 in	UL94 V-0	0.1 in	4.5 A	All	Tin	0.75 in	125 °C	-55 °C	30 µin	Board Board or Cable	0.079 in	Elevated Socket	Forked	Gold	Black	4	144	Liquid Crystal Polymer (LCP)	Square	Phosphor Bronze
Samtec Inc. ESQT-136-02-G-Q-750	Through Hole	Solder	Push-Pull	0.079 in	UL94 V-0	0.1 in	4.5 A	All	Gold	0.75 in	125 °C	-55 °C	20 Ąin	Board Board or Cable	0.079 in	Elevated Socket	Forked	Gold	Black	4	144	Liquid Crystal Polymer (LCP)	Square	Phosphor Bronze	3 µin