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CONN IC DIP SOCKET 10POS GOLD
| Part | Mounting Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination | Contact Finish - Post | Contact Material - Post [custom] | Material Flammability Rating | Type | Type | Type | Contact Finish - Mating | Pitch - Mating | Pitch - Mating | Contact Material - Mating | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Housing Material | Features | Termination Post Length | Termination Post Length | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Operating Temperature [Max] | Operating Temperature [Min] | Current Rating (Amps) | Pitch - Post | Pitch - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Through Hole | 30 Áin | 0.76 Ám | Solder | Gold | Brass | UL94 V-0 | DIP | 0.6 in | 15.24 mm | Gold | 0.1 in | 2.54 mm | Beryllium Copper | 2 x 5 | 10 | Glass Filled Nylon 4/6 Polyamide (PA46) | Closed Frame Elevated | 3.56 mm | 0.14 in | 10 çin | 0.25 çm | 105 ░C | -55 °C | 3 A | 2.54 mm | 0.1 in |