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CONN IC DIP SOCKET 8POS GOLD
| Part | Features | Contact Material - Mating | Housing Material | Termination Post Length | Termination Post Length | Contact Finish - Post | Operating Temperature [Min] | Operating Temperature [Max] | Material Flammability Rating | Type | Type | Type | Contact Finish - Mating | Number of Positions or Pins (Grid) | Mounting Type | Pitch - Mating | Pitch - Mating | Current Rating (Amps) | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination | Contact Material - Post | Pitch - Post | Pitch - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Closed Frame | Phosphor Bronze | Glass Filled Nylon 4/6 Polyamide (PA46) | 0.15 in | 3.81 mm | Gold | -55 °C | 125 °C | UL94 V-0 | 0.3 " | 7.62 mm | DIP | Gold | 8 | Through Hole | 0.1 in | 2.54 mm | 1 A | 10 çin | 0.25 çm | Solder | Phosphor Bronze | 2.54 mm | 0.1 in | 10 çin | 0.25 çm |
Aries Electronics | Closed Frame | Phosphor Bronze | Glass Filled Nylon 4/6 Polyamide (PA46) | 0.15 in | 3.81 mm | Tin | -55 °C | 105 ░C | UL94 V-0 | 0.3 " | 7.62 mm | DIP | 8 | Through Hole | 0.1 in | 2.54 mm | 1 A | 200 µin | 5.08 µm | Solder | Phosphor Bronze | 2.54 mm | 0.1 in | 200 µin | 5.08 µm |