BM28B0.6 Series

Catalog

CONN RCPT 58POS SMD GOLD

Part	Contact Finish	Height Above Board	Number of Positions	Features	Number of Rows	Pitch	Mounting Type	Contact Finish Thickness	Connector Type	Mated Stacking Height	Number of Positions (Power)	Number of Positions (Normal)	Number of Positions (Total)
Hirose Electric Co Ltd BM28B0.6-58DS/2-0.35V(51)	Gold	0.024 in	58	Solder Retention	2	0.014 in	Surface Mount	1.97 µin	Center Strip Contacts Receptacle	0.6 mm
Hirose Electric Co Ltd BM28B0.6-44DS/2-0.35V(53)	Gold	0.024 in		Solder Retention	2	0.014 in	Surface Mount	1.97 µin	Center Strip Contacts Receptacle	0.6 mm	2	44	46
Hirose Electric Co Ltd BM28B0.6-36DP/2-0.35V(53)	Gold	0.018 in	36	Solder Retention	2	0.014 in	Surface Mount	1.97 µin	Header Outer Shroud Contacts	0.6 mm
Hirose Electric Co Ltd BM28B0.6-60DS/2-0.35V(53)	Gold	0.024 in		Solder Retention	2	0.014 in	Surface Mount	1.97 µin	Center Strip Contacts Receptacle	0.6 mm	2	60	62
Hirose Electric Co Ltd BM28B0.6-34DP/2-0.35V(53)	Gold	0.018 in	34	Solder Retention	2	0.014 in	Surface Mount	1.97 µin	Header Outer Shroud Contacts	0.6 mm
Hirose Electric Co Ltd BM28B0.6-44DP/2-0.35V(51)	Gold	0.018 in		Solder Retention	2	0.014 in	Surface Mount	1.97 µin	Header Outer Shroud Contacts	0.6 mm	2	44	46
Hirose Electric Co Ltd BM28B0.6-44DP/2-0.35V(53)	Gold	0.018 in		Solder Retention	2	0.014 in	Surface Mount	1.97 µin	Header Outer Shroud Contacts	0.6 mm	2	44	46
Hirose Electric Co Ltd BM28B0.6-16DS/2-0.35V(61)
Hirose Electric Co Ltd BM28B0.6-60DS/2-0.35V(51)	Gold	0.024 in		Solder Retention	2	0.014 in	Surface Mount	1.97 µin	Center Strip Contacts Receptacle	0.6 mm	2	60	62
Hirose Electric Co Ltd BM28B0.6-10DP/2-0.35V(51)	Gold	0.018 in	10	Solder Retention	2	0.014 in	Surface Mount	1.97 µin	Header Outer Shroud Contacts	0.6 mm