10061913 Series
Manufacturer: Amphenol ICC (FCI)
CONN PCI EXP FMALE 164POS 0.039
| Part | Card Thickness | Pitch | Contact Finish | Card Type | Mounting Type | Gender | Features | Termination | Number of Rows | Contact Type | Contact Material | Color | Number of Positions | Read Out | Operating Temperature (Min) | Operating Temperature (Max) | Contact Finish Thickness | Material - Insulation | Contact Finish Thickness (string set options) | Contact Finish Thickness | Termination Rows | Number of Bay |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Amphenol ICC (FCI) | 0.062 in | 0.039 in | Gold | PCI Express™ | Surface Mount | Female | Board Guide Locking Ramp Solder Retention | Solder | 2 | Cantilever | Copper Alloy | Black | 164 | Dual | -55 °C | 85 °C | 30 µin | Glass Filled Nylon PA Polyamide | ||||
Amphenol ICC (FCI) | 0.062 in | 0.039 in | Gold | PCI Express™ | Surface Mount | Female | Board Guide Locking Ramp Pick and Place Solder Retention | Solder | 2 | Cantilever | Copper Alloy | Black | 36 | Dual | -55 °C | 85 °C | 15 µin | Glass Filled Nylon PA Polyamide | ||||
Amphenol ICC (FCI) | 0.062 in | 0.039 in | Gold | PCI Express™ | Surface Mount | Female | Board Guide Locking Ramp Pick and Place Solder Retention | Solder | 2 | Cantilever | Copper Alloy | Black | 36 | Dual | -55 °C | 85 °C | 0 | Glass Filled Nylon PA Polyamide | Flash | Flash | ||
Amphenol ICC (FCI) | 0.062 in | 0.039 in | Gold | PCI Express™ | Surface Mount | Female | Board Guide Locking Ramp Pick and Place Solder Retention | Solder | 2 | Cantilever | Copper Alloy | Black | 98 | Dual | -55 °C | 85 °C | 15 µin | Glass Filled Nylon PA Polyamide | 2 rows | |||
Amphenol ICC (FCI) | 0.062 in | 0.039 in | Gold | PCI Express™ | Surface Mount | Female | Board Guide Locking Ramp Pick and Place Solder Retention | Solder | 2 | Cantilever | Copper Alloy | Black | 36 | Dual | -55 °C | 85 °C | 15 µin | Glass Filled Nylon PA Polyamide | ||||
Amphenol ICC (FCI) | 0.062 in | 0.039 in | Gold | PCI Express™ | Surface Mount | Female | Board Guide Locking Ramp Pick and Place Solder Retention | Solder | 2 | Cantilever | Copper Alloy | Black | 164 | Dual | -55 °C | 85 °C | 30 µin | Glass Filled Nylon PA Polyamide | ||||
Amphenol ICC (FCI) | 0.062 in | 0.039 in | Gold | PCI Express™ | Surface Mount | Female | Board Guide Locking Ramp Pick and Place Solder Retention | Solder | 2 | Cantilever | Copper Alloy | Black | 64 | Dual | -55 °C | 85 °C | 0 | Glass Filled Nylon PA Polyamide | Flash | Flash | ||
Amphenol ICC (FCI) | 0.062 in | 0.039 in | Gold | PCI Express™ | Surface Mount | Female | Board Guide Locking Ramp Pick and Place Solder Retention | Solder | 2 | Cantilever | Copper Alloy | Black | 36 | Dual | -55 °C | 85 °C | 30 µin | Glass Filled Nylon PA Polyamide | ||||
Amphenol ICC (FCI) | 0.062 in | 0.039 in | Gold | PCI Express™ | Surface Mount | Female | Board Guide Locking Ramp Pick and Place Solder Retention | Solder | 2 | Cantilever | Copper Alloy | Black | 11 164 | Dual | -55 °C | 85 °C | 0 | Glass Filled Nylon PA Polyamide | Flash | Flash | 71 | |
Amphenol ICC (FCI) | 0.062 in | 0.039 in | Gold | PCI Express™ | Surface Mount | Female | Board Guide Locking Ramp Pick and Place Solder Retention | Solder | 2 | Cantilever | Copper Alloy | Black | 36 | Dual | -55 °C | 85 °C | 15 µin | Glass Filled Nylon PA Polyamide |