44-6551 Series

Catalog

CONN IC DIP SOCKET ZIF 44POS GLD

Part	Current Rating	Termination Post Length	Material Flammability Rating	Contact Material - Mating	Pitch - Mating	Number of Positions or Pins (Grid)	Grid Rows	Grid Columns	Housing Material	Contact Finish - Mating	Features	Contact Finish - Post	Pitch - Post	Contact Material - Post	Termination	Row Spacing	Type	Mounting Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Operating Temperature (Max)	Operating Temperature (Min)
Aries Electronics 44-6551-11	1 A	0.11 in	UL94 V-0	Beryllium Copper	0.1 in	44	2	22	Glass Filled Polyphenylene Sulfide PPS	Gold	Closed Frame	Gold	0.1 in	Beryllium Copper	Solder	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Through Hole
Aries Electronics 44-6551-10	1 A	0.11 in	UL94 V-0	Beryllium Copper	0.1 in	44	2	22	Glass Filled Polyphenylene Sulfide PPS	Tin	Closed Frame	Tin	0.1 in	Beryllium Copper	Solder	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Through Hole	200 Ąin	200 µin
Aries Electronics 44-6551-18	1 A	0.11 in	UL94 V-0	Beryllium Nickel	0.1 in	44	2	22	Glass Filled PEEK Polyetheretherketone	Boron Nickel	Closed Frame	Nickel Boron	0.1 in	Beryllium Nickel	Solder	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Through Hole	50 µin	50 µin	250 °C	-55 °C
Aries Electronics 44-6551-16	1 A	0.11 in	UL94 V-0	Beryllium Copper	0.1 in	44	2	22	Glass Filled Polyphenylene Sulfide PPS	Boron Nickel	Closed Frame	Nickel Boron	0.1 in	Beryllium Copper	Solder	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Through Hole	50 µin	50 µin