SLM-122 Series
Headers & Wire Housings Through-Hole Micro Socket, 0.050" x 0.100" Pitch
Manufacturer: Samtec Inc.
Catalog
Headers & Wire Housings Through-Hole Micro Socket, 0.050" x 0.100" Pitch
Headers & Wire Housings Through-Hole Micro Socket, 0.050" x 0.100" Pitch
Headers & Wire Housings Through-Hole Micro Socket, 0.050" x 0.100" Pitch
Headers & Wire Housings Through-Hole Micro Socket, 0.050" x 0.100" Pitch
| Part | Termination | Insulation Material | Contact Finish - Mating | Number of Rows | Insulation Color | Fastening Type | Number of Positions Loaded | Connector Type | Operating Temperature [Min] | Operating Temperature [Max] | Contact Finish - Post | Insulation Height | Insulation Height | Mounting Type | Row Spacing - Mating [x] | Row Spacing - Mating [x] | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Shape | Pitch - Mating | Pitch - Mating | Contact Length - Post | Contact Length - Post | Contact Material | Contact Type | Number of Positions | Contact Finish Thickness - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Solder | Liquid Crystal Polymer (LCP) | Gold | 2 | Black | Push-Pull | All | Receptacle | -55 °C | 125 °C | Tin | 4.57 mm | 0.18 " | Through Hole | 2.54 mm | 0.1 in | 10 çin | 0.25 çm | Rectangular | 0.05 in | 1.27 mm | 2.92 mm | 0.115 in | Phosphor Bronze | Forked | |||
Samtec Inc. | Solder | Liquid Crystal Polymer (LCP) | Gold | 2 | Black | Push-Pull | All | Receptacle | -55 °C | 125 °C | Gold | 4.57 mm | 0.18 " | Through Hole | 2.54 mm | 0.1 in | 20 µin | 0.51 µm | Rectangular | 0.05 in | 1.27 mm | 2.92 mm | 0.115 in | Phosphor Bronze | Forked | 50 | 3 µin | 0.076 µm |
Samtec Inc. | Solder | Liquid Crystal Polymer (LCP) | 2 | Black | Push-Pull | All | Receptacle | -55 °C | 105 ░C | Tin | 4.57 mm | 0.18 " | Through Hole | 2.54 mm | 0.1 in | Rectangular | 0.05 in | 1.27 mm | 2.92 mm | 0.115 in | Phosphor Bronze | Forked | 12 | |||||
Samtec Inc. | Solder | Liquid Crystal Polymer (LCP) | Gold | 1 | Black | Push-Pull | All | Receptacle | -55 °C | 125 °C | Gold | 4.57 mm | 0.18 " | Through Hole | 20 µin | 0.51 µm | Rectangular | 0.05 in | 1.27 mm | 2.92 mm | 0.115 in | Phosphor Bronze | Forked | 23 | 3 µin | 0.076 µm | ||
Samtec Inc. | Solder | Liquid Crystal Polymer (LCP) | Gold | 2 | Black | Push-Pull | All | Receptacle | -55 °C | 125 °C | Tin | 4.57 mm | 0.18 " | Through Hole | 2.54 mm | 0.1 in | 10 çin | 0.25 çm | Rectangular | 0.05 in | 1.27 mm | 2.92 mm | 0.115 in | Phosphor Bronze | Forked | 12 | ||
Samtec Inc. | Solder | Liquid Crystal Polymer (LCP) | Gold | 1 | Black | Push-Pull | All | Receptacle | -55 °C | 125 °C | Tin | 4.57 mm | 0.18 " | Through Hole | 3 µin | 0.076 µm | Rectangular | 0.05 in | 1.27 mm | 2.92 mm | 0.115 in | Phosphor Bronze | Forked | 14 | ||||
Samtec Inc. | Solder | Liquid Crystal Polymer (LCP) | Gold | 1 | Black | Push-Pull | All | Receptacle | -55 °C | 125 °C | Gold | 4.57 mm | 0.18 " | Through Hole | 20 µin | 0.51 µm | Rectangular | 0.05 in | 1.27 mm | 2.92 mm | 0.115 in | Phosphor Bronze | Forked | 6 | 3 µin | 0.076 µm | ||
Samtec Inc. | Solder | Liquid Crystal Polymer (LCP) | Gold | 2 | Black | Push-Pull | All | Receptacle | -55 °C | 125 °C | Tin | 4.57 mm | 0.18 " | Through Hole | 2.54 mm | 0.1 in | 3 µin | 0.076 µm | Rectangular | 0.05 in | 1.27 mm | 2.92 mm | 0.115 in | Phosphor Bronze | Forked | 6 | ||
Samtec Inc. | Solder | Liquid Crystal Polymer (LCP) | Gold | 1 | Black | Push-Pull | All | Receptacle | -55 °C | 125 °C | Tin | 4.57 mm | 0.18 " | Through Hole | 10 çin | 0.25 çm | Rectangular | 0.05 in | 1.27 mm | 2.92 mm | 0.115 in | Phosphor Bronze | Forked | |||||
Samtec Inc. | Solder | Liquid Crystal Polymer (LCP) | 2 | Black | Push-Pull | All | Receptacle | -55 °C | 105 ░C | Tin | 4.57 mm | 0.18 " | Through Hole | 2.54 mm | 0.1 in | Rectangular | 0.05 in | 1.27 mm | 2.92 mm | 0.115 in | Phosphor Bronze | Forked | 28 |