HEATSINK CPU 43MM SQ BLK H=.4"
| Part | Type | Material | Power Dissipation @ Temperature Rise | Fin Height | Fin Height | Shape | Length | Length | Attachment Method | Width [x] | Width [x] | Thermal Resistance @ Forced Air Flow | Material Finish | Package Cooled | 
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Wakefield-Vette  | Top Mount  | Aluminum  | 2.5 W  | 0.4 "  | 10.16 mm  | Pin Fins  Square  | 44.45 mm  | 1.75 in  | Thermal Tape  Adhesive (Not Included)  | 43.18 mm  | 1.7 in  | 4 °C/W  300 LFM  | Black Anodized  | ASIC  BGA  CPU  LGA  | 
Wakefield-Vette  | Top Mount  | Aluminum  | 2.5 W  | 4 in  | 101.6 mm  | Pin Fins  Square  | 44.45 mm  | 1.75 in  | Thermal Tape  Adhesive (Included)  | 43.18 mm  | 1.7 in  | 4 °C/W  300 LFM  | Black Anodized  | ASIC  BGA  CPU  LGA  |