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CONN IC DIP SOCKET 28POS GOLD
| Part | Number of Positions or Pins (Grid) | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Mating | Pitch - Mating | Housing Material | Contact Material - Mating | Mounting Type | Contact Material - Post [custom] | Pitch - Post | Pitch - Post | Contact Finish - Mating | Features | Termination Post Length | Termination Post Length | Type | Type | Type | Current Rating (Amps) | Termination | Contact Finish - Post | Operating Temperature [Max] | Operating Temperature [Min] | Material Flammability Rating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 28 | 10 çin | 0.25 çm | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | Glass Filled Nylon 4/6 Polyamide (PA46) | Beryllium Copper | Through Hole | Brass | 2.54 mm | 0.1 in | Gold | Closed Frame Elevated | 3.56 mm | 0.14 in | DIP | 0.6 in | 15.24 mm | 3 A | Solder | Gold | 105 ░C | -55 °C | UL94 V-0 |