TSW-148 Series

Catalog

CONN HEADER VERT 96POS 2.54MM

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Part	Contact Length - Post	Shrouding	Mounting Type	Contact Shape	Overall Contact Length	Insulation Height	Operating Temperature (Max)	Operating Temperature (Min)	Pitch - Mating	Contact Material	Termination	Number of Positions Loaded	Contact Finish Thickness - Mating	Number of Positions	Contact Type	Insulation Material	Number of Rows	Contact Finish - Post	Insulation Color	Contact Length - Mating	Connector Type	Style	Contact Finish - Mating	Material Flammability Rating	Row Spacing - Mating	Fastening Type	Contact Finish Thickness - Post
Samtec Inc. TSW-148-17-L-D	0.11 in	Unshrouded	Through Hole	Square	0.83 in	0.1 in	125 °C	-55 °C	0.1 in	Phosphor Bronze	Solder	All	10 µin	96	Male Pin	Polybutylene Terephthalate (PBT)	2	Tin	Black	0.62 in	Header	Board Board or Cable	Gold	UL94 V-0	0.1 in	Push-Pull
Samtec Inc. TSW-148-08-S-D	0.2 in	Unshrouded	Through Hole	Square	0.53 in	0.1 in	125 °C	-55 °C	0.1 in	Phosphor Bronze	Solder	All	30 µin	96	Male Pin	Polybutylene Terephthalate (PBT)	2	Tin	Black	0.23 in	Header	Board Board or Cable	Gold	UL94 V-0	0.1 in	Push-Pull
Samtec Inc. TSW-148-07-S-T	0.1 in	Unshrouded	Through Hole	Square	0.43 in	0.1 in	125 °C	-55 °C	0.1 in	Phosphor Bronze	Solder	All	30 µin	144	Male Pin	Polybutylene Terephthalate (PBT)	3	Tin	Black	0.23 in	Header	Board Board or Cable	Gold	UL94 V-0	0.1 in	Push-Pull
Samtec Inc. TSW-148-26-L-D	0.126 in	Unshrouded	Through Hole	Square	0.456 in	0.1 in	125 °C	-55 °C	0.1 in	Phosphor Bronze	Solder	All	10 µin	96	Male Pin	Polybutylene Terephthalate (PBT)	2	Tin	Black	0.23 in	Header	Board Board or Cable	Gold	UL94 V-0	0.1 in	Push-Pull
Samtec Inc. TSW-148-08-T-S	0.2 in	Unshrouded	Through Hole	Square	0.53 in	0.1 in	105 °C	-55 °C	0.1 in	Phosphor Bronze	Solder	All		48	Male Pin	Polybutylene Terephthalate (PBT)	1	Tin	Black	0.23 in	Header	Board Board or Cable	Tin	UL94 V-0		Push-Pull
Samtec Inc. TSW-148-05-G-D	0.13 in	Unshrouded	Through Hole	Square	0.335 in	0.1 in	125 °C	-55 °C	0.1 in	Phosphor Bronze	Solder	All	10 µin	96	Male Pin	Polybutylene Terephthalate (PBT)	2	Gold	Black	0.105 in	Header	Board Board or Cable	Gold	UL94 V-0	0.1 in	Push-Pull	3 µin
Samtec Inc. TSW-148-08-L-D	0.2 in	Unshrouded	Through Hole	Square	0.53 in	0.1 in	125 °C	-55 °C	0.1 in	Phosphor Bronze	Solder	All	10 µin	96	Male Pin	Polybutylene Terephthalate (PBT)	2	Tin	Black	0.23 in	Header	Board Board or Cable	Gold	UL94 V-0	0.1 in	Push-Pull
Samtec Inc. TSW-148-07-S-S	0.1 in	Unshrouded	Through Hole	Square	0.43 in	0.1 in	125 °C	-55 °C	0.1 in	Phosphor Bronze	Solder	All	30 µin	48	Male Pin	Polybutylene Terephthalate (PBT)	1	Tin	Black	0.23 in	Header	Board Board or Cable	Gold	UL94 V-0		Push-Pull
Samtec Inc. TSW-148-19-L-D
Samtec Inc. TSW-148-14-L-S	0.11 in	Unshrouded	Through Hole	Square	0.53 in	0.1 in	125 °C	-55 °C	0.1 in	Phosphor Bronze	Solder	All	10 µin	48	Male Pin	Polybutylene Terephthalate (PBT)	1	Tin	Black	0.32 in	Header	Board Board or Cable	Gold	UL94 V-0		Push-Pull