CONN RCPT 180POS 0.05 GOLD SMD
| Part | Fastening Type | Contact Finish - Post | Contact Type | Pitch - Mating | Pitch - Mating | Operating Temperature [Min] | Operating Temperature [Max] | Contact Shape | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Row Spacing - Mating | Row Spacing - Mating | Mounting Type | Current Rating (Amps) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Material | Termination | Insulation Material | Number of Positions Loaded | Connector Type | Features | Insulation Height [z] | Insulation Height [z] | Material Flammability Rating | Number of Positions | Insulation Color |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Push-Pull | Gold | Forked | 0.05 in | 1.27 mm | -55 °C | 125 °C | Square | 3 µin | 0.076 µm | 0.05 in | 1.27 mm | Surface Mount | 2.4 A | Gold | 30 Áin | 0.76 Ám | Phosphor Bronze | Solder | Liquid Crystal Polymer (LCP) | All | Receptacle | Pick and Place | 0.16 in | 4.06 mm | UL94 V-0 | 180 | Black |
Samtec Inc. | Push-Pull | Gold | Forked | 0.05 in | 1.27 mm | -55 °C | 125 °C | Square | 3 µin | 0.076 µm | 0.05 in | 1.27 mm | Surface Mount | 2.4 A | Gold | 10 çin | 0.25 çm | Phosphor Bronze | Solder | Liquid Crystal Polymer (LCP) | All | Receptacle | Board Guide Pick and Place | 0.16 in | 4.06 mm | UL94 V-0 | 180 | Black |
Samtec Inc. | Push-Pull | Gold | Forked | 0.05 in | 1.27 mm | -55 °C | 125 °C | Square | 3 µin | 0.076 µm | 0.05 in | 1.27 mm | Surface Mount | 2.4 A | Gold | 30 Áin | 0.76 Ám | Phosphor Bronze | Solder | Liquid Crystal Polymer (LCP) | All | Receptacle | Board Lock Pick and Place | 0.16 in | 4.06 mm | UL94 V-0 | 180 | Black |
Samtec Inc. | Push-Pull | Gold | Forked | 0.05 in | 1.27 mm | -55 °C | 125 °C | Square | 3 µin | 0.076 µm | 0.05 in | 1.27 mm | Surface Mount | 2.4 A | Gold | 30 Áin | 0.76 Ám | Phosphor Bronze | Solder | Liquid Crystal Polymer (LCP) | All | Receptacle | Pick and Place | 0.16 in | 4.06 mm | UL94 V-0 | 180 | Black |
Samtec Inc. | Push-Pull | Gold | Forked | 0.05 in | 1.27 mm | -55 °C | 125 °C | Square | 3 µin | 0.076 µm | 0.05 in | 1.27 mm | Surface Mount | 2.4 A | Gold | 30 Áin | 0.76 Ám | Phosphor Bronze | Solder | Liquid Crystal Polymer (LCP) | All | Receptacle | Board Lock Pick and Place | 0.16 in | 4.06 mm | UL94 V-0 | 180 | Black |
Samtec Inc. | Push-Pull | Gold | Forked | 0.05 in | 1.27 mm | -55 °C | 125 °C | Square | 3 µin | 0.076 µm | 0.05 in | 1.27 mm | Surface Mount | 2.4 A | Gold | 10 çin | 0.25 çm | Phosphor Bronze | Solder | Liquid Crystal Polymer (LCP) | All | Receptacle | Board Guide | 0.16 in | 4.06 mm | UL94 V-0 | 180 | Black |
Samtec Inc. | Push-Pull | Gold | Forked | 0.05 in | 1.27 mm | -55 °C | 125 °C | Square | 3 µin | 0.076 µm | 0.05 in | 1.27 mm | Surface Mount | 2.4 A | Gold | 30 Áin | 0.76 Ám | Phosphor Bronze | Solder | Liquid Crystal Polymer (LCP) | All | Receptacle | Board Guide Pick and Place | 0.16 in | 4.06 mm | UL94 V-0 | 180 | Black |
Samtec Inc. | Push-Pull | Gold | Forked | 0.05 in | 1.27 mm | -55 °C | 125 °C | Square | 3 µin | 0.076 µm | 0.05 in | 1.27 mm | Surface Mount | 2.4 A | Gold | 30 Áin | 0.76 Ám | Phosphor Bronze | Solder | Liquid Crystal Polymer (LCP) | All | Receptacle | Pick and Place | 0.16 in | 4.06 mm | UL94 V-0 | 180 | Black |