Beta
⌘K
CONN SOCKET PGA ZIF GOLD
| Part | Contact Finish - Mating | Termination | Current Rating (Amps) | Pitch - Mating | Pitch - Mating | Material Flammability Rating | Pitch - Post | Pitch - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Features | Contact Finish - Post | Type | Operating Temperature [Max] | Operating Temperature [Min] | Termination Post Length | Termination Post Length | Contact Material - Post | Contact Material - Mating | Mounting Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Gold | Solder | 1 A | 0.1 in | 2.54 mm | UL94 V-0 | 2.54 mm | 0.1 in | 200 µin | 5.08 µm | 30 Áin | 0.76 Ám | Closed Frame | Tin | PGA ZIF (ZIP) | 125 °C | -65 ░C | 3.18 mm | 0.125 in | Beryllium Copper | Beryllium Copper | Through Hole |