CONN SOCKET PGA ZIF GOLD
| Part | Contact Finish - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Mounting Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Number of Positions or Pins (Grid) | Termination | Operating Temperature [Max] | Operating Temperature [Min] | Pitch - Mating | Pitch - Mating | Contact Material - Mating | Contact Material - Post | Pitch - Post | Pitch - Post | Material Flammability Rating | Contact Finish - Mating | Current Rating (Amps) | Type | Termination Post Length | Termination Post Length | Features |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Tin | 30 Áin | 0.76 Ám | Through Hole | 200 µin | 5.08 µm | 225 positions or pins | Solder | 125 °C | -65 ░C | 0.1 in | 2.54 mm | Beryllium Copper | Beryllium Copper | 2.54 mm | 0.1 in | UL94 V-0 | Gold | 1 A | PGA ZIF (ZIP) | 3.18 mm | 0.125 in | Closed Frame |
Aries Electronics | Tin | 30 Áin | 0.76 Ám | Through Hole | 200 µin | 5.08 µm | Solder | 125 °C | -65 ░C | 0.1 in | 2.54 mm | Beryllium Copper | Beryllium Copper | 2.54 mm | 0.1 in | UL94 V-0 | Gold | 1 A | PGA ZIF (ZIP) | 3.18 mm | 0.125 in | Closed Frame | |
Aries Electronics | Tin | 30 Áin | 0.76 Ám | Through Hole | 200 µin | 5.08 µm | Solder | 125 °C | -65 ░C | 0.1 in | 2.54 mm | Beryllium Copper | Beryllium Copper | 2.54 mm | 0.1 in | UL94 V-0 | Gold | 1 A | PGA ZIF (ZIP) | 3.18 mm | 0.125 in | Closed Frame |