Beta
⌘K
CONN SOCKET PGA ZIF GOLD
| Part | Operating Temperature [Max] | Operating Temperature [Min] | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Current Rating (Amps) | Contact Material - Post | Contact Material - Mating | Material Flammability Rating | Contact Finish - Post | Termination Post Length | Termination Post Length | Contact Finish - Mating | Pitch - Mating | Pitch - Mating | Mounting Type | Features | Termination | Pitch - Post | Pitch - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 125 °C | -65 ░C | 200 µin | 5.08 µm | PGA ZIF (ZIP) | 30 Áin | 0.76 Ám | 1 A | Beryllium Copper | Beryllium Copper | UL94 V-0 | Tin | 3.18 mm | 0.125 in | Gold | 0.1 in | 2.54 mm | Through Hole | Closed Frame | Solder | 2.54 mm | 0.1 in |