ESS-116 Series

Catalog

CONN SOCKET 16POS 0.1 TIN PCB

Part	Mounting Type	Insulation Height	Contact Finish - Mating	Operating Temperature (Max)	Operating Temperature (Min)	Insulation Color	Termination	Contact Type	Connector Type	Number of Positions	Number of Rows	Contact Finish - Post	Fastening Type	Material Flammability Rating	Pitch - Mating	Number of Positions Loaded	Style	Contact Length - Post	Contact Shape	Insulation Material	Contact Material	Contact Finish Thickness - Mating	Contact Finish Thickness - Post
Samtec Inc. ESS-116-TT-05	Through Hole	0.5 in	Tin	125 °C	-55 °C	Black	Solder	Female Socket	Elevated Socket	16	1	Tin	Push-Pull	UL94 V-0	0.1 in	All	Board	0.173 in	Circular	Liquid Crystal Polymer (LCP)	Beryllium Copper
Samtec Inc. ESS-116-TT-04	Through Hole	0.4 in	Tin	125 °C	-55 °C	Black	Solder	Female Socket	Elevated Socket	16	1	Tin	Push-Pull	UL94 V-0	0.1 in	All	Board	0.123 in	Circular	Liquid Crystal Polymer (LCP)	Beryllium Copper
Samtec Inc. ESS-116-T-03	Through Hole	0.3 in	Gold	125 °C	-55 °C	Black	Solder	Female Socket	Elevated Socket	16	1	Tin	Push-Pull	UL94 V-0	0.1 in	All	Board	0.123 in	Circular	Liquid Crystal Polymer (LCP)	Beryllium Copper	10 µin
Samtec Inc. ESS-116-G-04	Through Hole	0.4 in	Gold	125 °C	-55 °C	Black	Solder	Female Socket	Elevated Socket	16	1	Gold	Push-Pull	UL94 V-0	0.1 in	All	Board	0.123 in	Circular	Liquid Crystal Polymer (LCP)	Beryllium Copper	10 µin	10 µin
Samtec Inc. ESS-116-TT-24	Through Hole	0.4 in	Tin	125 °C	-55 °C	Black	Solder	Female Socket	Elevated Socket	16	1	Tin	Push-Pull	UL94 V-0	0.1 in	All	Board	0.123 in	Circular	Liquid Crystal Polymer (LCP)	Beryllium Copper
Samtec Inc. ESS-116-T-07	Through Hole	0.4 in	Gold	125 °C	-55 °C	Black	Solder	Female Socket	Elevated Socket	16	1	Tin	Push-Pull	UL94 V-0	0.1 in	All	Board	0.265 in	Circular	Liquid Crystal Polymer (LCP)	Beryllium Copper	10 µin
Samtec Inc. ESS-116-G-23	Through Hole	0.3 in	Gold	125 °C	-55 °C	Black	Solder	Female Socket	Elevated Socket	16	1	Gold	Push-Pull	UL94 V-0	0.1 in	All	Board	0.123 in	Circular	Liquid Crystal Polymer (LCP)	Beryllium Copper	10 µin	10 µin
Samtec Inc. ESS-116-T-04	Through Hole	0.4 in	Gold	125 °C	-55 °C	Black	Solder	Female Socket	Elevated Socket	16	1	Tin	Push-Pull	UL94 V-0	0.1 in	All	Board	0.123 in	Circular	Liquid Crystal Polymer (LCP)	Beryllium Copper	10 µin
Samtec Inc. ESS-116-T-06	Through Hole	0.3 in	Gold	125 °C	-55 °C	Black	Solder	Female Socket	Elevated Socket	16	1	Tin	Push-Pull	UL94 V-0	0.1 in	All	Board	0.215 in	Circular	Liquid Crystal Polymer (LCP)	Beryllium Copper	10 µin