32-6551 Series

Catalog

CONN IC DIP SOCKET ZIF 32POS TIN

Part	Pitch - Mating	Pitch - Mating	Contact Material - Post	Termination Post Length	Termination Post Length	Current Rating (Amps)	Contact Finish - Post	Features	Material Flammability Rating	Contact Material - Mating	Housing Material	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Post	Pitch - Post	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Type	Type	Type	Termination	Mounting Type	Contact Finish - Mating	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 32-6551-10	0.1 in	2.54 mm	Beryllium Copper	0.11 in	2.78 mm	1 A	Tin	Closed Frame	UL94 V-0	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled	200 µin	5.08 µm	2.54 mm	0.1 in	2 x 16	32	5.08 µm	200 µin	15.24 mm	DIP ZIF (ZIP)	0.6 "	Solder	Through Hole
Aries Electronics 32-6551-11	0.1 in	2.54 mm	Beryllium Copper	0.11 in	2.78 mm	1 A	Gold	Closed Frame	UL94 V-0	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled			2.54 mm	0.1 in	2 x 16	32			15.24 mm	DIP ZIF (ZIP)	0.6 "	Solder	Through Hole	Gold
Aries Electronics 32-6551-16	0.1 in	2.54 mm	Beryllium Copper	0.11 in	2.78 mm	1 A	Nickel Boron	Closed Frame	UL94 V-0	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled	50 µin	1.27 µm	2.54 mm	0.1 in	2 x 16	32	1.27 µm	50 µin	15.24 mm	DIP ZIF (ZIP)	0.6 "	Solder	Through Hole	Nickel Boron
Aries Electronics 32-6551-18	0.1 in	2.54 mm	Beryllium Nickel	0.11 in	2.78 mm	1 A	Nickel Boron	Closed Frame	UL94 V-0	Beryllium Nickel	Polyetheretherketone (PEEK) Glass Filled	50 µin	1.27 µm	2.54 mm	0.1 in	2 x 16	32	1.27 µm	50 µin	15.24 mm	DIP ZIF (ZIP)	0.6 "	Solder	Through Hole	Nickel Boron	-55 °C	250 °C