32-6551 Series

Catalog

CONN IC DIP SOCKET ZIF 32POS TIN

Part	Current Rating	Material Flammability Rating	Termination Post Length	Grid Columns	Number of Positions or Pins (Grid)	Grid Rows	Termination	Contact Finish Thickness - Mating	Contact Material - Post	Contact Finish Thickness - Post	Housing Material	Pitch - Post	Contact Finish - Mating	Contact Finish - Post	Pitch - Mating	Row Spacing	Type	Mounting Type	Features	Contact Material - Mating	Operating Temperature (Max)	Operating Temperature (Min)
Aries Electronics 32-6551-10	1 A	UL94 V-0	0.11 in	16	32	2	Solder	200 Ąin	Beryllium Copper	200 µin	Glass Filled Polyphenylene Sulfide PPS	0.1 in	Tin	Tin	0.1 in	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Through Hole	Closed Frame	Beryllium Copper
Aries Electronics 32-6551-11	1 A	UL94 V-0	0.11 in	16	32	2	Solder		Beryllium Copper		Glass Filled Polyphenylene Sulfide PPS	0.1 in	Gold	Gold	0.1 in	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Through Hole	Closed Frame	Beryllium Copper
Aries Electronics 32-6551-16	1 A	UL94 V-0	0.11 in	16	32	2	Solder	50 µin	Beryllium Copper	50 µin	Glass Filled Polyphenylene Sulfide PPS	0.1 in	Boron Nickel	Nickel Boron	0.1 in	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Through Hole	Closed Frame	Beryllium Copper
Aries Electronics 32-6551-18	1 A	UL94 V-0	0.11 in	16	32	2	Solder	50 µin	Beryllium Nickel	50 µin	Glass Filled PEEK Polyetheretherketone	0.1 in	Boron Nickel	Nickel Boron	0.1 in	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Through Hole	Closed Frame	Beryllium Nickel	250 °C	-55 °C