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CONN IC DIP SOCKET ZIF 32POS TIN
| Part | Features | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Post | Type | Type | Type | Contact Material - Post | Termination Post Length | Termination Post Length | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Current Rating (Amps) | Material Flammability Rating | Termination | Contact Material - Mating | Pitch - Post | Pitch - Post | Housing Material | Mounting Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Closed Frame | 0.1 in | 2.54 mm | 5.08 µm | 200 µin | 200 µin | 5.08 µm | Tin | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | Beryllium Copper | 0.11 in | 2.78 mm | 2 x 16 | 32 | 1 A | UL94 V-0 | Solder | Beryllium Copper | 2.54 mm | 0.1 in | Polyphenylene Sulfide (PPS) Glass Filled | Through Hole |
Aries Electronics | Closed Frame | 0.1 in | 2.54 mm | 5.08 µm | 200 µin | 200 µin | 5.08 µm | Tin | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | Beryllium Copper | 0.11 in | 2.78 mm | 2 x 16 | 32 | 1 A | UL94 V-0 | Solder | Beryllium Copper | 2.54 mm | 0.1 in | Polyphenylene Sulfide (PPS) Glass Filled | Through Hole |