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CONN IC DIP SOCKET ZIF 28POS
| Part | Contact Finish - Post | Mounting Type | Termination Post Length | Termination Post Length | Features | Housing Material | Number of Positions or Pins (Grid) | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Post | Pitch - Post | Type | Type | Type | Contact Material - Mating | Material Flammability Rating | Current Rating (Amps) | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Mating | Contact Material - Post | Termination |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Nickel Boron | Through Hole | 0.11 in | 2.78 mm | Closed Frame | Polyphenylene Sulfide (PPS) Glass Filled | 28 | 1.27 µm | 50 µin | 2.54 mm | 0.1 in | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | Beryllium Nickel | UL94 V-0 | 1 A | 0.1 in | 2.54 mm | 1.27 µm | 50 µin | Nickel Boron | Beryllium Nickel | Solder |