2P DIP GOLD BERYLLIUM COPPER ALLOY -55℃~+105℃ 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS
| Part | Contact Finish - Mating | Pitch - Post | Pitch - Post | Mounting Type | Type | Type | Type | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Material Flammability Rating | Contact Material - Post [custom] | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Operating Temperature [Max] | Operating Temperature [Min] | Contact Material - Mating | Contact Finish - Post | Housing Material | Features | Termination | Current Rating (Amps) | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination Post Length | Termination Post Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics 02-3513-10 | Gold | 2.54 mm | 0.1 in | Through Hole | 0.3 " | 7.62 mm | DIP | 1 x 2 | 2 | UL94 V-0 | Brass | 0.1 in | 2.54 mm | 200 µin | 5.08 µm | 105 ░C | -55 °C | Beryllium Copper | Tin | Glass Filled, Nylon 4/6, Polyamide (PA46) | Closed Frame | Solder | 3 A | 10 çin | 0.25 çm | 3.18 mm | 0.125 in |