CONN SOCKET 18POS 0.1 GOLD PCB
| Part | Number of Positions Loaded | Insulation Height | Insulation Height | Material Flammability Rating | Contact Finish - Mating | Connector Type | Contact Type | Contact Shape | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Insulation Material | Contact Material | Termination | Number of Rows | Fastening Type | Pitch - Mating | Pitch - Mating | Contact Length - Post | Contact Length - Post | Contact Finish - Post | Operating Temperature [Min] | Operating Temperature [Max] | Number of Positions | Mounting Type | Insulation Color | Contact Length - Post [x] | Contact Length - Post [x] | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Insulation Height [z] | Insulation Height [z] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | All | 0.5 in | 12.7 mm | UL94 V-0 | Gold | Elevated Socket | Female Socket | Circular | 10 çin | 0.25 çm | Liquid Crystal Polymer (LCP) | Beryllium Copper | Solder | 1 | Push-Pull | 0.1 in | 2.54 mm | 0.173 in | 4.4 mm | Tin | -55 °C | 125 °C | 18 | Through Hole | Black | ||||||
Samtec Inc. | All | 0.4 in | 10.16 mm | UL94 V-0 | Gold | Elevated Socket | Female Socket | Circular | 10 çin | 0.25 çm | Liquid Crystal Polymer (LCP) | Beryllium Copper | Solder | 1 | Push-Pull | 0.1 in | 2.54 mm | Gold | -55 °C | 125 °C | 18 | Through Hole | Black | 3.12 mm | 0.123 in | 10 çin | 0.25 çm | ||||
Samtec Inc. | All | 0.5 in | 12.7 mm | UL94 V-0 | Elevated Socket | Female Socket | Circular | Liquid Crystal Polymer (LCP) | Beryllium Copper | Solder | 1 | Push-Pull | 0.1 in | 2.54 mm | 0.173 in | 4.4 mm | Tin | -55 °C | 125 °C | 18 | Through Hole | Black | |||||||||
Samtec Inc. | All | 0.4 in | 10.16 mm | UL94 V-0 | Elevated Socket | Female Socket | Circular | Liquid Crystal Polymer (LCP) | Beryllium Copper | Solder | 1 | Push-Pull | 0.1 in | 2.54 mm | Tin | -55 °C | 125 °C | 18 | Through Hole | Black | 3.12 mm | 0.123 in | |||||||||
Samtec Inc. | All | UL94 V-0 | Elevated Socket | Female Socket | Circular | Liquid Crystal Polymer (LCP) | Beryllium Copper | Solder | 1 | Push-Pull | 0.1 in | 2.54 mm | Tin | -55 °C | 125 °C | 18 | Through Hole | Black | 3.12 mm | 0.123 in | 0.3 in | 7.62 mm | |||||||||
Samtec Inc. | All | UL94 V-0 | Gold | Elevated Socket | Female Socket | Circular | 10 çin | 0.25 çm | Liquid Crystal Polymer (LCP) | Beryllium Copper | Solder | 1 | Push-Pull | 0.1 in | 2.54 mm | Gold | -55 °C | 125 °C | 18 | Through Hole | Black | 3.12 mm | 0.123 in | 10 çin | 0.25 çm | 0.3 in | 7.62 mm | ||||
Samtec Inc. | All | 0.5 in | 12.7 mm | UL94 V-0 | Gold | Elevated Socket | Female Socket | Circular | 10 çin | 0.25 çm | Liquid Crystal Polymer (LCP) | Beryllium Copper | Solder | 1 | Push-Pull | 0.1 in | 2.54 mm | 0.173 in | 4.4 mm | Tin | -55 °C | 125 °C | 18 | Through Hole | Black | ||||||
Samtec Inc. | All | UL94 V-0 | Gold | Elevated Socket | Female Socket | Circular | 10 çin | 0.25 çm | Liquid Crystal Polymer (LCP) | Beryllium Copper | Solder | 1 | Push-Pull | 0.1 in | 2.54 mm | Tin | -55 °C | 125 °C | 18 | Through Hole | Black | 5.66 mm | 0.223 in | 0.3 in | 7.62 mm | ||||||
Samtec Inc. | All | UL94 V-0 | Gold | Elevated Socket | Female Socket | Circular | 10 çin | 0.25 çm | Liquid Crystal Polymer (LCP) | Beryllium Copper | Solder | 1 | Push-Pull | 0.1 in | 2.54 mm | Tin | -55 °C | 125 °C | 18 | Through Hole | Black | 3.12 mm | 0.123 in | 0.3 in | 7.62 mm | ||||||
Samtec Inc. | All | 0.5 in | 12.7 mm | UL94 V-0 | Elevated Socket | Female Socket | Circular | Liquid Crystal Polymer (LCP) | Beryllium Copper | Solder | 1 | Push-Pull | 0.1 in | 2.54 mm | 0.173 in | 4.4 mm | Tin | -55 °C | 125 °C | 18 | Through Hole | Black |