ESS-118 Series
Manufacturer: Samtec Inc.
CONN SOCKET 18POS 0.1 GOLD PCB
| Part | Contact Type | Contact Length - Post | Contact Finish Thickness - Mating | Operating Temperature (Max) | Operating Temperature (Min) | Number of Positions | Connector Type | Style | Number of Positions Loaded | Mounting Type | Contact Finish - Mating | Insulation Color | Fastening Type | Pitch - Mating | Material Flammability Rating | Insulation Height | Number of Rows | Termination | Contact Finish - Post | Contact Finish Thickness - Post | Insulation Material | Contact Shape | Contact Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Female Socket | 0.123 in | 10 µin | 125 °C | -55 °C | 18 | Elevated Socket | Board | All | Through Hole | Gold | Black | Push-Pull | 0.1 in | UL94 V-0 | 0.4 in | 1 | Solder | Gold | 10 µin | Liquid Crystal Polymer (LCP) | Circular | Beryllium Copper |
Samtec Inc. | Female Socket | 0.123 in | 125 °C | -55 °C | 18 | Elevated Socket | Board | All | Through Hole | Tin | Black | Push-Pull | 0.1 in | UL94 V-0 | 0.4 in | 1 | Solder | Tin | Liquid Crystal Polymer (LCP) | Circular | Beryllium Copper | ||
Samtec Inc. | Female Socket | 0.123 in | 125 °C | -55 °C | 18 | Elevated Socket | Board | All | Through Hole | Tin | Black | Push-Pull | 0.1 in | UL94 V-0 | 0.3 in | 1 | Solder | Tin | Liquid Crystal Polymer (LCP) | Circular | Beryllium Copper | ||
Samtec Inc. | Female Socket | 0.123 in | 10 µin | 125 °C | -55 °C | 18 | Elevated Socket | Board | All | Through Hole | Gold | Black | Push-Pull | 0.1 in | UL94 V-0 | 0.3 in | 1 | Solder | Gold | 10 µin | Liquid Crystal Polymer (LCP) | Circular | Beryllium Copper |
Samtec Inc. | Female Socket | 0.173 in | 10 µin | 125 °C | -55 °C | 18 | Elevated Socket | Board | All | Through Hole | Gold | Black | Push-Pull | 0.1 in | UL94 V-0 | 0.5 in | 1 | Solder | Tin | Liquid Crystal Polymer (LCP) | Circular | Beryllium Copper | |
Samtec Inc. | Female Socket | 0.223 in | 10 µin | 125 °C | -55 °C | 18 | Elevated Socket | Board | All | Through Hole | Gold | Black | Push-Pull | 0.1 in | UL94 V-0 | 0.3 in | 1 | Solder | Tin | Liquid Crystal Polymer (LCP) | Circular | Beryllium Copper | |
Samtec Inc. | Female Socket | 0.123 in | 10 µin | 125 °C | -55 °C | 18 | Elevated Socket | Board | All | Through Hole | Gold | Black | Push-Pull | 0.1 in | UL94 V-0 | 0.3 in | 1 | Solder | Tin | Liquid Crystal Polymer (LCP) | Circular | Beryllium Copper | |
Samtec Inc. | Female Socket | 0.173 in | 125 °C | -55 °C | 18 | Elevated Socket | Board | All | Through Hole | Tin | Black | Push-Pull | 0.1 in | UL94 V-0 | 0.5 in | 1 | Solder | Tin | Liquid Crystal Polymer (LCP) | Circular | Beryllium Copper | ||
Samtec Inc. | Female Socket | 0.173 in | 10 µin | 125 °C | -55 °C | 18 | Elevated Socket | Board | All | Through Hole | Gold | Black | Push-Pull | 0.1 in | UL94 V-0 | 0.5 in | 1 | Solder | Gold | 10 µin | Liquid Crystal Polymer (LCP) | Circular | Beryllium Copper |
Samtec Inc. | Female Socket | 0.173 in | 10 µin | 125 °C | -55 °C | 18 | Elevated Socket | Board | All | Through Hole | Gold | Black | Push-Pull | 0.1 in | UL94 V-0 | 0.5 in | 1 | Solder | Gold | 10 µin | Liquid Crystal Polymer (LCP) | Circular | Beryllium Copper |