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CONN IC DIP SOCKET 8POS GOLD
| Part | Operating Temperature [Max] | Operating Temperature [Min] | Pitch - Post | Pitch - Post | Termination | Type | Type | Type | Termination Post Length | Termination Post Length | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Number of Positions or Pins (Grid) | Material Flammability Rating | Features | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Housing Material | Current Rating (Amps) | Contact Finish - Post | Pitch - Mating | Pitch - Mating | Contact Material - Post [custom] | Contact Material - Mating | Mounting Type | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 105 ░C | -55 °C | 2.54 mm | 0.1 in | Solder | 0.4 in | 10.16 mm | DIP | 3.18 mm | 0.125 in | 10 çin | 0.25 çm | 8 | UL94 V-0 | Closed Frame | 10 çin | 0.25 çm | Glass Filled Nylon 4/6 Polyamide (PA46) | 3 A | Gold | 0.1 in | 2.54 mm | Brass | Beryllium Copper | Through Hole | Gold |
Aries Electronics | 105 ░C | -55 °C | 2.54 mm | 0.1 in | Solder | 0.4 in | 10.16 mm | DIP | 3.18 mm | 0.125 in | 200 µin | 5.08 µm | 8 | UL94 V-0 | Closed Frame | 10 çin | 0.25 çm | Glass Filled Nylon 4/6 Polyamide (PA46) | 3 A | Tin | 0.1 in | 2.54 mm | Brass | Beryllium Copper | Through Hole | Gold |