08-4513 Series

Catalog

CONN IC DIP SOCKET 8POS GOLD

Part	Pitch - Post	Pitch - Mating	Features	Housing Material	Contact Finish - Post	Termination	Contact Finish - Mating	Contact Material - Post	Grid Columns	Grid Rows	Number of Positions or Pins (Grid)	Row Spacing	Type	Contact Finish Thickness - Mating	Operating Temperature (Min)	Operating Temperature (Max)	Contact Finish Thickness - Post	Contact Material - Mating	Mounting Type	Termination Post Length	Material Flammability Rating	Current Rating
Aries Electronics 08-4513-11	0.1 in	0.1 in	Closed Frame	Glass Filled Nylon 4/6 PA46 Polyamide	Gold	Solder	Gold	Brass	4	2	8	0.4 in	0.4" (10.16mm) Row Spacing DIP	10 µin	-55 °C	105 °C	10 µin	Beryllium Copper	Through Hole	0.125 in	UL94 V-0	3 A
Aries Electronics 08-4513-11H	0.1 in	0.1 in	Closed Frame	Glass Filled Nylon 4/6 PA46 Polyamide	Gold	Solder	Gold	Brass	4	2	8	0.4 in	0.4" (10.16mm) Row Spacing DIP	10 µin	-55 °C	105 °C	10 µin	Beryllium Copper	Through Hole	0.125 in	UL94 V-0	3 A
Aries Electronics 08-4513-10T	0.1 in	0.1 in	Closed Frame	Glass Filled Nylon 4/6 PA46 Polyamide	Tin	Solder	Gold	Brass	4	2	8	0.4 in	0.4" (10.16mm) Row Spacing DIP	10 µin	-55 °C	105 °C	200 µin	Beryllium Copper	Through Hole	0.125 in	UL94 V-0	3 A