614-87 Series
Manufacturer: Preci-Dip
Beta
⌘K
CONN IC DIP SOCKET 325POS GOLD
| Part | Housing Material | Pitch - Mating | Contact Material - Mating | Mounting Type | Contact Finish Thickness - Mating | Contact Finish - Post | Termination | Contact Finish - Mating | Operating Temperature (Max) | Operating Temperature (Min) | Features | Row Spacing | Type | Number of Positions or Pins (Grid) | Grid Rows | Grid Columns | Pitch - Post | Contact Material - Post | Termination Post Length | Contact Resistance | Current Rating | Material Flammability Rating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Preci-Dip | Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester | 0.1 in | Beryllium Copper | Through Hole | Flash | Tin | Solder | Gold | 125 °C | -55 °C | Carrier Open Frame | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | 325 | 18 | 18 | 0.1 in | Brass | 0.136 in | 10 mOhm | 1 A | UL94 V-0 |
Preci-Dip | Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester | 0.1 in | Beryllium Copper | Through Hole | Flash | Tin | Solder | Gold | 125 °C | -55 °C | Carrier Open Frame | 0.2 in | 0.2" (5.08mm) Row Spacing DIP | 10 | 2 | 5 | 0.1 in | Brass | 0.136 in | 10 mOhm | 1 A | UL94 V-0 |
Preci-Dip | Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester | 0.1 in | Beryllium Copper | Through Hole | Flash | Tin | Solder | Gold | 125 °C | -55 °C | Carrier Open Frame | PGA | 296 | 19 | 19 | 0.1 in | Brass | 0.136 in | 10 mOhm | 1 A | UL94 V-0 | |
Preci-Dip | Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester | 0.1 in | Beryllium Copper | Through Hole | Flash | Tin | Solder | Gold | 125 °C | -55 °C | Carrier Open Frame | PGA | 144 | 15 | 15 | 0.1 in | Brass | 0.136 in | 10 mOhm | 1 A | UL94 V-0 | |
Preci-Dip | Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester | 0.1 in | Beryllium Copper | Through Hole | Flash | Tin | Solder | Gold | 125 °C | -55 °C | Carrier Open Frame | PGA | 175 count | 16 | 16 | 0.1 in | Brass | 0.136 in | 10 mOhm | 1 A | UL94 V-0 | |
Preci-Dip | Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester | 0.1 in | Beryllium Copper | Through Hole | Flash | Tin | Solder | Gold | 125 °C | -55 °C | Carrier Open Frame | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | 321 | 21 | 21 | 0.1 in | Brass | 0.136 in | 10 mOhm | 1 A | UL94 V-0 |
Preci-Dip | Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester | 0.1 in | Beryllium Copper | Through Hole | Flash | Tin | Solder | Gold | 125 °C | -55 °C | Carrier Open Frame | PGA | 179 | 18 | 18 | 0.1 in | Brass | 0.136 in | 10 mOhm | 1 A | UL94 V-0 | |
Preci-Dip | Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester | 0.1 in | Beryllium Copper | Through Hole | Flash | Tin | Solder | Gold | 125 °C | -55 °C | Carrier Open Frame | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | 10 | 2 | 5 | 0.1 in | Brass | 0.136 in | 10 mOhm | 1 A | UL94 V-0 |
Preci-Dip | Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester | 0.1 in | Beryllium Copper | Through Hole | Flash | Tin | Solder | Gold | 125 °C | -55 °C | Carrier Open Frame | 0.9 in | 0.9" (22.86mm) Row Spacing DIP | 52 | 2 | 26 | 0.1 in | Brass | 0.136 in | 10 mOhm | 1 A | UL94 V-0 |
Preci-Dip | Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester | 0.1 in | Beryllium Copper | Through Hole | Flash | Tin | Solder | Gold | 125 °C | -55 °C | Carrier Open Frame | PGA | 101 | 13 | 13 | 0.1 in | Brass | 0.136 in | 10 mOhm | 1 A | UL94 V-0 |