116-93 Series
Manufacturer: Mill-Max Manufacturing Corp.
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CONN IC SKT DBL
| Part | Termination Post Length | Current Rating | Operating Temperature (Max) | Operating Temperature (Min) | Pitch - Mating | Features | Grid Columns | Number of Positions or Pins (Grid) | Grid Rows | Pitch - Post | Contact Material - Post | Contact Finish Thickness - Mating | Termination | Housing Material | Mounting Type | Contact Material - Mating | Row Spacing | Type | Contact Finish Thickness - Post | Contact Finish - Mating | Contact Finish - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Mill-Max Manufacturing Corp. | 0.108 in | 3 A | 125 °C | -55 °C | 0.1 in | Elevated Open Frame | 26 | 52 | 2 | 0.1 in | Brass Alloy | 30 µin | Solder | PCT Polycyclohexylenedimethylene Terephthalate Polyester | Through Hole | Beryllium Copper | 0.6 in | 0.6" (15.24mm) Row Spacing DIP | 200 µin | Gold | Tin-Lead |
Mill-Max Manufacturing Corp. | 0.108 in | 3 A | 125 °C | -55 °C | 0.1 in | Elevated Open Frame | 9 | 18 | 2 | 0.1 in | Brass Alloy | 30 µin | Solder | PCT Polycyclohexylenedimethylene Terephthalate Polyester | Through Hole | Beryllium Copper | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | 200 µin | Gold | Tin-Lead |
Mill-Max Manufacturing Corp. | 0.108 in | 3 A | 125 °C | -55 °C | 0.1 in | Elevated Open Frame | 24 | 48 | 2 | 0.1 in | Brass Alloy | 30 µin | Solder | PCT Polycyclohexylenedimethylene Terephthalate Polyester | Through Hole | Beryllium Copper | 0.6 in | 0.6" (15.24mm) Row Spacing DIP | 200 µin | Gold | Tin-Lead |
Mill-Max Manufacturing Corp. | 0.108 in | 3 A | 125 °C | -55 °C | 0.1 in | Elevated Open Frame | 7 | 14 | 2 | 0.1 in | Brass Alloy | 30 µin | Solder | PCT Polycyclohexylenedimethylene Terephthalate Polyester | Through Hole | Beryllium Copper | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | 200 µin | Gold | Tin-Lead |
Mill-Max Manufacturing Corp. | 0.108 in | 3 A | 125 °C | -55 °C | 0.1 in | Elevated Open Frame | 16 | 32 | 2 | 0.1 in | Brass Alloy | 30 µin | Solder | PCT Polycyclohexylenedimethylene Terephthalate Polyester | Through Hole | Beryllium Copper | 0.6 in | 0.6" (15.24mm) Row Spacing DIP | 200 µin | Gold | Tin-Lead |
Mill-Max Manufacturing Corp. | 0.108 in | 3 A | 125 °C | -55 °C | 0.1 in | Elevated Open Frame | 12 | 24 | 2 | 0.1 in | Brass Alloy | 30 µin | Solder | PCT Polycyclohexylenedimethylene Terephthalate Polyester | Through Hole | Beryllium Copper | 0.4 in | 0.4" (10.16mm) Row Spacing DIP | 200 µin | Gold | Tin-Lead |
Mill-Max Manufacturing Corp. | 0.108 in | 3 A | 125 °C | -55 °C | 0.1 in | Elevated Open Frame | 25 | 50 | 2 | 0.1 in | Brass Alloy | 30 µin | Solder | PCT Polycyclohexylenedimethylene Terephthalate Polyester | Through Hole | Beryllium Copper | 0.9 in | 0.9" (22.86mm) Row Spacing DIP | 200 µin | Gold | Tin-Lead |
Mill-Max Manufacturing Corp. | 0.108 in | 3 A | 125 °C | -55 °C | 0.1 in | Elevated Open Frame | 25 | 50 | 2 | 0.1 in | Brass Alloy | 30 µin | Solder | PCT Polycyclohexylenedimethylene Terephthalate Polyester | Through Hole | Beryllium Copper | 0.9 in | 0.9" (22.86mm) Row Spacing DIP | 200 µin | Gold | Tin-Lead |
Mill-Max Manufacturing Corp. | 0.108 in | 3 A | 125 °C | -55 °C | 0.1 in | Elevated Open Frame | 14 | 28 | 2 | 0.1 in | Brass Alloy | 30 µin | Solder | PCT Polycyclohexylenedimethylene Terephthalate Polyester | Through Hole | Beryllium Copper | 0.4 in | 0.4" (10.16mm) Row Spacing DIP | 200 µin | Gold | Tin-Lead |
Mill-Max Manufacturing Corp. | 0.108 in | 3 A | 125 °C | -55 °C | 0.1 in | Elevated Open Frame | 18 | 36 | 2 | 0.1 in | Brass Alloy | 30 µin | Solder | PCT Polycyclohexylenedimethylene Terephthalate Polyester | Through Hole | Beryllium Copper | 0.6 in | 0.6" (15.24mm) Row Spacing DIP | 200 µin | Gold | Tin-Lead |