CONN IC DIP SOCKET ZIF 28POS
| Part | Contact Finish - Post | Current Rating (Amps) | Number of Positions or Pins (Grid) | Pitch - Mating | Pitch - Mating | Termination Post Length | Termination Post Length | Material Flammability Rating | Type | Type | Type | Contact Material - Post | Housing Material | Contact Material - Mating | Mounting Type | Features | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Termination | Pitch - Post | Pitch - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Nickel Boron | 1 A | 28 | 0.1 in | 2.54 mm | 0.11 in | 2.78 mm | UL94 V-0 | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | Beryllium Copper | Polyphenylene Sulfide (PPS) Glass Filled | Beryllium Copper | Through Hole | Closed Frame | 1.27 µm | 50 µin | Nickel Boron | 1.27 µm | 50 µin | Solder | 2.54 mm | 0.1 in |
Aries Electronics | Gold | 1 A | 28 | 0.1 in | 2.54 mm | 0.11 in | 2.78 mm | UL94 V-0 | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | Beryllium Copper | Polyphenylene Sulfide (PPS) Glass Filled | Beryllium Copper | Through Hole | Closed Frame | Gold | Solder | 2.54 mm | 0.1 in |