FTE-112 Series
Manufacturer: Samtec Inc.
CONN HEADER SMD 24POS 0.8MM
| Part | Current Rating (Per Contact) | Insulation Material | Row Spacing - Mating | Number of Positions | Insulation Color | Number of Positions Loaded | Connector Type | Contact Finish Thickness - Mating | Operating Temperature (Max) | Operating Temperature (Min) | Number of Rows | Termination | Fastening Type | Pitch - Mating | Style | Contact Length - Mating | Material Flammability Rating | Contact Shape | Mounting Type | Features | Shrouding | Insulation Height | Contact Finish - Mating | Contact Material | Contact Finish - Post | Contact Type | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 2.7 A | Liquid Crystal Polymer (LCP) | 0.047 in | 24 pos | Black | All | Header | 10 µin | 125 °C | -55 °C | 2 | Solder | Push-Pull | 0.031 in | Board | 0.12 in | UL94 V-0 | Square | Surface Mount | Pick and Place | Unshrouded | 0.055 in | Gold | Phosphor Bronze | Gold | Male Pin | |
Samtec Inc. | 2.7 A | Liquid Crystal Polymer (LCP) | 0.047 in | 24 pos | Black | All | Header | 10 µin | 125 °C | -55 °C | 2 | Solder | Push-Pull | 0.031 in | Board | 0.075 in | UL94 V-0 | Square | Surface Mount | Board Guide End Shrouds | Unshrouded | 0.055 in | Gold | Phosphor Bronze | Gold | Male Pin | |
Samtec Inc. | 2.7 A | Liquid Crystal Polymer (LCP) | 0.047 in | 24 pos | Black | All | Header | 10 µin | 125 °C | -55 °C | 2 | Solder | Push-Pull | 0.031 in | Board | 0.12 in | UL94 V-0 | Square | Surface Mount | Unshrouded | 0.055 in | Gold | Phosphor Bronze | Gold | Male Pin | ||
Samtec Inc. | 2.7 A | Liquid Crystal Polymer (LCP) | 0.047 in | 24 pos | Black | All | Header | 10 µin | 125 °C | -55 °C | 2 | Solder | Push-Pull | 0.031 in | Board | 0.075 in | UL94 V-0 | Square | Surface Mount | Pick and Place | Unshrouded | 0.055 in | Gold | Phosphor Bronze | Gold | Male Pin | |
Samtec Inc. | 2.7 A | Liquid Crystal Polymer (LCP) | 0.047 in | 24 pos | Black | All | Header | 10 µin | 125 °C | -55 °C | 2 | Solder | Push-Pull | 0.031 in | Board | 0.075 in | UL94 V-0 | Square | Right Angle Surface Mount | Pick and Place | Unshrouded | 0.12 in | Gold | Phosphor Bronze | Gold | Male Pin | |
Samtec Inc. | 2.7 A | Liquid Crystal Polymer (LCP) | 0.047 in | 24 pos | Black | All | Header | 10 µin | 125 °C | -55 °C | 2 | Solder | Push-Pull | 0.031 in | Board | 0.075 in | UL94 V-0 | Square | Right Angle Surface Mount | Unshrouded | 0.12 in | Gold | Phosphor Bronze | Gold | Male Pin | 3 µin | |
Samtec Inc. | 2.7 A | Liquid Crystal Polymer (LCP) | 0.047 in | 24 pos | Black | All | Header | 10 µin | 125 °C | -55 °C | 2 | Solder | Push-Pull | 0.031 in | Board | 0.075 in | UL94 V-0 | Square | Surface Mount | End Shrouds Pick and Place | Unshrouded | 0.055 in | Gold | Phosphor Bronze | Gold | Male Pin | |
Samtec Inc. | 2.7 A | Liquid Crystal Polymer (LCP) | 0.047 in | 24 pos | Black | All | Header | 10 µin | 125 °C | -55 °C | 2 | Solder | Push-Pull | 0.031 in | Board | 0.075 in | UL94 V-0 | Square | Surface Mount | Board Guide End Shrouds | Unshrouded | 0.055 in | Gold | Phosphor Bronze | Gold | Male Pin | |
Samtec Inc. | 2.7 A | Liquid Crystal Polymer (LCP) | 0.047 in | 24 pos | Black | All | Header | 10 µin | 125 °C | -55 °C | 2 | Solder | Push-Pull | 0.031 in | Board | 0.175 in | UL94 V-0 | Square | Right Angle Surface Mount | Unshrouded | 0.12 in | Gold | Phosphor Bronze | Gold | Male Pin | ||
Samtec Inc. | 2.7 A | Liquid Crystal Polymer (LCP) | 0.047 in | 24 pos | Black | All | Header | 10 µin | 125 °C | -55 °C | 2 | Solder | Push-Pull | 0.031 in | Board | 0.075 in | UL94 V-0 | Square | Surface Mount | End Shrouds | Unshrouded | 0.055 in | Gold | Phosphor Bronze | Gold | Male Pin |