IC EPROM 256KBIT PAR 28CERDIP
| Part | Package / Case | Package / Case | Package / Case | Access Time | Memory Interface | Voltage - Supply [Min] | Voltage - Supply [Max] | Memory Organization | Memory Format | Memory Type | Technology | Operating Temperature [Max] | Operating Temperature [Min] | Mounting Type | Memory Size | Supplier Device Package | Operating Temperature [Max] | Operating Temperature [Min] | Supplier Device Package [y] | Supplier Device Package [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies | 28-CDIP Window | 0.6 in | 15.24 mm | 200 ns | Parallel | 4.5 V | 5.5 V | 32K x 8 | EPROM | Non-Volatile | EPROM - UV | 125 °C | -55 °C | Through Hole | 32 KB | 28-CERDIP | ||||
Infineon Technologies | 32-LCC (J-Lead) | 70 ns | Parallel | 4.5 V | 5.5 V | 32K x 8 | EPROM | Non-Volatile | EPROM - OTP | Surface Mount | 32 KB | 32-PLCC | 70 °C | 0 °C | 11.43 | 13.97 | ||||
Infineon Technologies | 28-CDIP Window | 0.6 in | 15.24 mm | 150 ns | Parallel | 4.5 V | 5.5 V | 32K x 8 | EPROM | Non-Volatile | EPROM - UV | Through Hole | 32 KB | 28-CERDIP | 85 °C | -40 °C | ||||
Infineon Technologies | 32-TFSOP | 0.724 in | 18.4 mm | 70 ns | Parallel | 4.5 V | 5.5 V | 32K x 8 | EPROM | Non-Volatile | EPROM - OTP | Surface Mount | 32 KB | 32-TSOP I | 70 °C | 0 °C | ||||
Infineon Technologies | 32-TFSOP | 0.724 in | 18.4 mm | 55 ns | Parallel | 4.5 V | 5.5 V | 32K x 8 | EPROM | Non-Volatile | EPROM - OTP | Surface Mount | 32 KB | 32-TSOP I | 85 °C | -40 °C | ||||
Infineon Technologies | 32-LCC (J-Lead) | 150 ns | Parallel | 4.5 V | 5.5 V | 32K x 8 | EPROM | Non-Volatile | EPROM - OTP | Surface Mount | 32 KB | 32-PLCC | 70 °C | 0 °C | 11.43 | 13.97 | ||||
Infineon Technologies | 32-TFSOP | 0.724 in | 18.4 mm | 45 ns | Parallel | 4.5 V | 5.5 V | 32K x 8 | EPROM | Non-Volatile | EPROM - OTP | Surface Mount | 32 KB | 32-TSOP I | 70 °C | 0 °C |