30-1518 Series

Catalog

CONN IC DIP SOCKET 30POS GOLD

Part	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Termination Post Length	Termination Post Length	Contact Finish - Post	Features	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Termination	Current Rating (Amps)	Contact Material - Post [custom]	Type	Type	Type	Pitch - Mating	Pitch - Mating	Pitch - Post	Pitch - Post	Mounting Type	Contact Material - Mating	Housing Material	Material Flammability Rating	Contact Finish - Mating
Aries Electronics 30-1518-10T	30	2	15	3.18 mm	0.125 in	Tin	Open Frame	10 çin	0.25 çm	200 µin	5.08 µm	Solder	3 A	Brass	DIP	5.08 mm	0.2 in	0.1 in	2.54 mm	2.54 mm	0.1 in	Through Hole	Beryllium Copper	Glass Filled Nylon 4/6 Polyamide (PA46)	UL94 V-0	Gold
Aries Electronics 30-1518-10H	30	2	15	3.18 mm	0.125 in	Tin	Open Frame	10 çin	0.25 çm	200 µin	5.08 µm	Solder	3 A	Brass	DIP	5.08 mm	0.2 in	0.1 in	2.54 mm	2.54 mm	0.1 in	Through Hole	Beryllium Copper	Glass Filled Nylon 4/6 Polyamide (PA46)	UL94 V-0	Gold
Aries Electronics 30-1518-10	30	2	15	3.18 mm	0.125 in	Tin	Open Frame	10 çin	0.25 çm	200 µin	5.08 µm	Solder	3 A	Brass	DIP	5.08 mm	0.2 in	0.1 in	2.54 mm	2.54 mm	0.1 in	Through Hole	Beryllium Copper	Glass Filled Nylon 4/6 Polyamide (PA46)	UL94 V-0	Gold