SN74F245 Series

Octal bus transceivers

Catalog

Octal bus transceivers

Part	Operating Temperature [Max]	Mounting Type	Current - Output High, Low	Output Type	Package / Case	Package / Case [y]	Package / Case [y]	Number of Elements	Voltage - Supply [Min]	Voltage - Supply [Max]	Supplier Device Package	Number of Bits per Element	Package / Case	Package / Case
Texas Instruments SN74F245DWR	70 °C	Surface Mount	3 mA 15 mA 24 mA 64 mA	3-State	20-SOIC	0.295 in	7.5 mm	1	4.5 V	5.5 V	20-SOIC	8
Texas Instruments SN74F245NSR	70 °C	Surface Mount	3 mA 15 mA 24 mA 64 mA	3-State	20-SOIC			1	4.5 V	5.5 V	20-SO	8	0.209 "	5.3 mm
Texas Instruments SN74F245DBR	70 °C	Surface Mount	3 mA 15 mA 24 mA 64 mA	3-State	20-SSOP			1	4.5 V	5.5 V	20-SSOP	8
Texas Instruments SN74F245DWE4	70 °C	Surface Mount	3 mA 15 mA 24 mA 64 mA		20-SOIC	0.295 in	7.5 mm	1	4.5 V	5.5 V	20-SOIC	8
Texas Instruments SN74F245DW	70 °C	Surface Mount	3 mA 15 mA 24 mA 64 mA	3-State	20-SOIC	0.295 in	7.5 mm	1	4.5 V	5.5 V	20-SOIC	8
Texas Instruments SN74F245N	70 °C	Through Hole	3 mA 15 mA 24 mA 64 mA	3-State	20-DIP			1	4.5 V	5.5 V	20-PDIP	8	0.3 in	7.62 mm
Texas Instruments SN74F245NG4	70 °C	Through Hole	3 mA 15 mA 24 mA 64 mA	3-State	20-DIP			1	4.5 V	5.5 V	20-PDIP	8	0.3 in	7.62 mm

Catalog

Octal bus transceivers

Key Features

• 3-State Outputs Drive Bus Lines DirectlyPackage Options Include Plastic Small-Outline (SOIC) and Shrink Small-Outline (SSOP) Packages, Ceramic Chip Carriers, and Plastic and Ceramic DIPs3-State Outputs Drive Bus Lines DirectlyPackage Options Include Plastic Small-Outline (SOIC) and Shrink Small-Outline (SSOP) Packages, Ceramic Chip Carriers, and Plastic and Ceramic DIPs

Description

These octal bus transceivers are designed for asynchronous communication between data buses. The devices transmit data from the A bus to the B bus or from the B bus to the A bus depending upon the logic level at the direction-control (DIR) input. The output enableinput can be used to disable the device so the buses are effectively isolated. The SN74F245 is available in TI's shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area. The SN54F245 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74F245 is characterized for operation from 0°C to 70°C. These octal bus transceivers are designed for asynchronous communication between data buses. The devices transmit data from the A bus to the B bus or from the B bus to the A bus depending upon the logic level at the direction-control (DIR) input. The output enableinput can be used to disable the device so the buses are effectively isolated. The SN74F245 is available in TI's shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area. The SN54F245 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74F245 is characterized for operation from 0°C to 70°C.