667-20 Series
Manufacturer: Wakefield Thermal Solutions
Beta
⌘K
HEAT SINK, FOR BOARD LEVEL POWER SEMICONDUCTOR, 9.67 °C/W, TO-220, 34.9 MM, 50.8 MM, 12.7 MM
| Part | Package Cooled | Material | Material Finish | Fin Height | Shape | Attachment Method | Length | Type | Thermal Resistance | Power Dissipation | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|
 Wakefield Thermal Solutions | TO-220 | Aluminum | Black Anodized | 2 in | Fins Rectangular | Bolt On PC Pin | 0.5 in | Board Level Vertical | 4.7 °C/W | 6 W | 1.375 in |
Wakefield Thermal Solutions | TO-220 | Aluminum | Black Anodized | 2 in | Fins Rectangular | Bolt On PC Pin | 0.5 in | Board Level Vertical | 4.7 °C/W | 6 W | 1.375 in |