FTR-125 Series
Manufacturer: Samtec Inc.
CONN HEADER SMD 50POS 1.27MM
| Part | Contact Finish Thickness - Mating | Number of Rows | Pitch - Mating | Number of Positions | Mounting Type | Insulation Material | Contact Length - Mating | Contact Finish - Mating | Connector Type | Features | Number of Positions Loaded | Row Spacing - Mating | Style | Current Rating (Per Contact) | Material Flammability Rating | Fastening Type | Contact Shape | Termination | Insulation Color | Operating Temperature (Max) | Operating Temperature (Min) | Shrouding | Contact Finish - Post | Contact Type | Insulation Height | Contact Material | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 30 µin | 2 | 0.05 in | 50 | Surface Mount | Liquid Crystal Polymer (LCP) | 0.205 in | Gold | Header | Board Guide Pick and Place | All | 0.1 in | Board | 3.1 A | UL94 V-0 | Push-Pull | Square | Solder | Black | 125 °C | -55 °C | Unshrouded | Tin | Male Pin | 0.1 in | Phosphor Bronze | |
Samtec Inc. | 10 µin | 2 | 0.05 in | 50 | Surface Mount | Liquid Crystal Polymer (LCP) | 0.1 in | Gold | Header | Board Guide | All | 0.1 in | Board | 3.1 A | UL94 V-0 | Push-Pull | Square | Solder | Black | 125 °C | -55 °C | Unshrouded | Gold | Male Pin | 0.1 in | Phosphor Bronze | 3 µin |
Samtec Inc. | 10 µin | 2 | 0.05 in | 50 | Surface Mount | Liquid Crystal Polymer (LCP) | 0.125 in | Gold | Header | Board Guide Pick and Place | All | 0.1 in | Board | 3.1 A | UL94 V-0 | Push-Pull | Square | Solder | Black | 125 °C | -55 °C | Unshrouded | Gold | Male Pin | 0.1 in | Phosphor Bronze | 3 µin |
Samtec Inc. | 30 µin | 1 | 0.05 in | 25 | Surface Mount | Liquid Crystal Polymer (LCP) | 0.19 in | Gold | Header | All | Board | 3.1 A | UL94 V-0 | Push-Pull | Square | Solder | Black | 125 °C | -55 °C | Unshrouded | Tin | Male Pin | 0.1 in | Phosphor Bronze | |||
Samtec Inc. | 2 | 0.05 in | 50 | Surface Mount | Liquid Crystal Polymer (LCP) | 0.1 in | Tin | Header | Pick and Place | All | 0.1 in | Board | 3.1 A | UL94 V-0 | Push-Pull | Square | Solder | Black | 125 °C | -55 °C | Unshrouded | Tin | Male Pin | 0.1 in | Phosphor Bronze | ||
Samtec Inc. | 10 µin | 2 | 0.05 in | 50 | Surface Mount | Liquid Crystal Polymer (LCP) | 0.39 in | Gold | Header | All | 0.1 in | Board | 3.1 A | UL94 V-0 | Push-Pull | Square | Solder | Black | 125 °C | -55 °C | Unshrouded | Tin | Male Pin | 0.1 in | Phosphor Bronze | ||
Samtec Inc. | 10 µin | 2 | 0.05 in | 50 | Surface Mount | Liquid Crystal Polymer (LCP) | 0.19 in | Gold | Header | Board Lock | All | 0.1 in | Board | 3.1 A | UL94 V-0 | Push-Pull | Square | Solder | Black | 125 °C | -55 °C | Unshrouded | Gold | Male Pin | 0.1 in | Phosphor Bronze | 3 µin |
Samtec Inc. | 10 µin | 2 | 0.05 in | 50 | Surface Mount | Liquid Crystal Polymer (LCP) | 0.23 in | Gold | Header | Pick and Place | All | 0.1 in | Board | 3.1 A | UL94 V-0 | Push-Pull | Square | Solder | Black | 125 °C | -55 °C | Unshrouded | Gold | Male Pin | 0.1 in | Phosphor Bronze | 3 µin |
Samtec Inc. | 30 µin | 2 | 0.05 in | 50 | Surface Mount | Liquid Crystal Polymer (LCP) | 0.205 in | Gold | Header | Board Guide Pick and Place | All | 0.1 in | Board | 3.1 A | UL94 V-0 | Push-Pull | Square | Solder | Black | 125 °C | -55 °C | Unshrouded | Tin | Male Pin | 0.1 in | Phosphor Bronze | |
Samtec Inc. | 2 | 0.05 in | 50 | Surface Mount | Liquid Crystal Polymer (LCP) | 0.125 in | Tin | Header | Board Guide Pick and Place | All | 0.1 in | Board | 3.1 A | UL94 V-0 | Push-Pull | Square | Solder | Black | 125 °C | -55 °C | Unshrouded | Tin | Male Pin | 0.1 in | Phosphor Bronze |