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A1P50S65M2-F Series

ACEPACK 1 sixpack topology, 650 V, 50 A trench gate field-stop IGBT M series, soft diode and NTC

Manufacturer: STMicroelectronics

Catalog

ACEPACK 1 sixpack topology, 650 V, 50 A trench gate field-stop IGBT M series, soft diode and NTC

Key Features

ACEPACK™ 1 power module
- DBC Cu Al2O3Cu
Sixpack topology
- 650 V, 50 A IGBTs and diodes
- Soft and fast recovery diode

Description

AI
This power module is a sixpack topology in an ACEPACK™ 1 package with NTC, integrating the advanced trench gate field-stop technologies from STMicroelectronics. This new IGBT technology represents the best compromise between conduction and switching loss, to maximize the efficiency of any converter system up to 20 kHz.