CONN IC DIP SOCKET 40POS GOLD
| Part | Contact Finish - Mating | Pitch - Mating | Pitch - Mating | Features | Contact Material - Post [custom] | Contact Material - Mating | Termination Post Length | Termination Post Length | Contact Finish - Post | Type | Type | Type | Housing Material | Current Rating (Amps) | Operating Temperature [Max] | Operating Temperature [Min] | Contact Finish Thickness - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Mounting Type | Pitch - Post | Pitch - Post | Material Flammability Rating | Termination |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Gold | 0.1 in | 2.54 mm | Open Frame | Brass | Beryllium Copper | 3.2 mm | 0.126 in | Gold | DIP | 0.6 in | 15.24 mm | Polyphenylene Sulfide (PPS), Glass Filled | 1 A | 125 °C | -65 ░C | Flash | 0.203 Ám | 8 Áin | 40 | 20 | 2 | Through Hole | 2.54 mm | 0.1 in | UL94 V-0 | Solder | |
Gold | 0.1 in | 2.54 mm | Closed Frame, Seal Tape | Brass | Beryllium Copper | 3.2 mm | 0.126 in | Gold | DIP | 0.6 in | 15.24 mm | Polyphenylene Sulfide (PPS), Glass Filled | 1 A | 125 °C | -65 ░C | Flash | 0.203 Ám | 8 Áin | 40 | 20 | 2 | Through Hole | 2.54 mm | 0.1 in | UL94 V-0 | Solder | |
Gold | 0.1 in | 2.54 mm | Open Frame | Brass | Beryllium Copper | 3.2 mm | 0.126 in | Gold | DIP | 0.6 in | 15.24 mm | Polyphenylene Sulfide (PPS), Glass Filled | 1 A | 125 °C | -65 ░C | Flash | 0.203 Ám | 8 Áin | 40 | 20 | 2 | Through Hole | 2.54 mm | 0.1 in | UL94 V-0 | Solder |